Silicon Package Engineer
Meta PlatformsJob Title
Silicon Package Engineer
Role Summary
Design and develop advanced ASIC packaging solutions for AI/ML and networking custom silicon. Work across silicon, system, manufacturing and external partners (ODM, OSAT, foundry) to take packaging concepts from feasibility to production and to improve manufacturability and cost.
Experience Level
Mid-level - typically expected to have 6+ years of relevant semiconductor packaging experience.
Responsibilities
Key responsibilities include packaging design, technology development, and cross-functional coordination from concept through manufacturing.
- Perform package design and feasibility studies for single-chip, multi-chip and SiP/module solutions targeting AI/ML and networking products.
- Lead development and integration of advanced packaging technologies (2.5D/3D, heterogeneous integration) with ecosystem partners and OSATs.
- Define test vehicles and execute design-of-experiments (DOE) to validate packaging approaches and manufacturing processes.
- Collaborate with silicon, architecture, PCB, NPI, quality and manufacturing teams; provide manufacturability feedback in design reviews.
- Support vendor selection and qualification (ODM, OEM, OSAT) and influence partner roadmaps to align with ASIC requirements.
- Analyze failure mechanisms and assembly/process interactions; recommend process and design improvements.
- Travel internationally as needed (typically quarterly) to engage partners and manufacturing sites.
Requirements
Must-have technical skills and experience. Preferred items listed separately.
- 6+ years of hands-on semiconductor packaging experience with ownership of advanced packaging development, assembly process and manufacturing.
- Deep practical knowledge of flip-chip, 2.5D and 3D packaging technologies and associated assembly processes (SMT, solder ball attach, microbumps, TSVs).
- Proven track record taking products from concept to production, including defining manufacturing specifications and vendor qualifications.
- Ability to communicate technical packaging decisions and manufacturing readiness to cross-functional teams and external partners.
- Experience collaborating with silicon design, architecture, system and manufacturing teams to deliver integrated packaging solutions.
- Ability to evaluate emerging packaging technologies and recommend application-relevant solutions.
- Willingness to travel internationally, typically once per quarter.
Education Requirements
Required: Bachelor’s degree in Materials Science, Mechanical Engineering, Electrical Engineering or related field, or equivalent practical experience. Preferred: Master’s or PhD in Materials Science, Mechanical Engineering, or related discipline. "Or equivalent practical experience" language is accepted.
About the Company
Company: Meta Platforms
Headquarters: Menlo Park, California, United States
American technology company that develops social networking products (Facebook, Instagram, WhatsApp) and invests in virtual/augmented reality hardware and software through Reality Labs, focusing on connectivity, advertising, and immersive computing experiences.
