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Senior Quantum Engineer

Microsoft
November 2, 2026
Full-time
Remote friendly (Redmond, Washington, United States)
Worldwide
$119,800 - $234,700 USD yearly
Device Engineering Jobs, Level - Senior

Job Title

Senior Quantum Engineer

Role Summary

Design and simulate next-generation quantum processing unit (QPU) chips focused on topological qubits. Work on wiring, interfaces, and co-design with control and readout layers to advance scalable quantum computing.

Collaborate with fabrication, packaging, systems, and control teams; develop tools and simulation-driven, fabrication-aware workflows to enable device-to-system integration.

Experience Level

Senior. The role targets experienced engineers (senior-level responsibilities and cross-team leadership). Specific years-of-experience expectations are listed under Education Requirements.

Responsibilities

Key responsibilities include design, simulation, and integration of QPU chips and interfaces, and developing tools and processes to support co-design and scale.

  • Develop QPU chip designs and interfaces to readout/control layers using simulation-driven, fabrication-aware workflows.
  • Perform RF and electromagnetic simulations of chips and interface layers to define requirements and optimize control/readout performance.
  • Partner with fabrication, systems, packaging, and control teams to integrate constraints and requirements into designs.
  • Build and maintain design tools, create device models, and enable co-design across internal teams and external partners.
  • Apply IC design principles and engineering best practices to improve design processes and recommend optimizations.

Requirements

Concise list of required and preferred technical skills, plus security/citizenship screening requirements.

  • Must-have: Hands-on experience in quantum device design and RF/electromagnetic simulation for device, chip, or interconnect modeling.
  • Must-have: Proficiency with chip/circuit design and verification tools (EDA tools for IC/ASIC design, physical design, verification) and SPICE-based or similar simulators.
  • Must-have: Experience with semiconductor device design, fabrication processes, and process design kits (PDKs).
  • Must-have: Strong software skills (Python) and collaborative development using Git/GitHub.
  • Must-have: Ability to pass Microsoft Cloud background check and satisfy citizenship/immigration verification needed to access export-controlled information.
  • Preferred / Nice-to-have: Experience with thermal modeling in cryogenic regimes, use of Ansys/COMSOL or custom modeling tools.
  • Preferred / Nice-to-have: Prior experience with chip or PCB design involving mixed-signal, high-speed RF/digital circuits or quantum devices.
  • Preferred / Nice-to-have: Familiarity with AI-first workflows and building AI agents/copilots to accelerate experiment setup, log triage, and measurement/report generation.

Education Requirements

Required: Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field plus 3+ years technical engineering experience; OR Bachelor's degree in those fields plus 5+ years technical engineering experience; OR equivalent practical experience. Preferred: PhD in a related field (or advanced degree) with commensurate experience. Fields mentioned: Electrical Engineering, Computer Engineering, Mechanical Engineering, or related technical disciplines. Equivalency language is explicitly allowed.


About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.

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Date Posted: 2026-10-28