Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

Job Title

Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

Role Summary

Lead CPI qualification programs from concept through qualification and technology release, coordinating global cross-functional teams and external assembly and test partners (OSATs).

Based in Malta, NY. The role focuses on semiconductor packaging, post-fab processes, BEOL integration, and reliability qualification to enable advanced packaging solutions and technology release.

Experience Level

Senior-level. Minimum of 5 years of experience in the semiconductor industry in technology development, packaging, assembly, reliability, qualification, or related areas.

Responsibilities

Accountable for end-to-end management and technical leadership of CPI qualification projects.

• Define qualification strategies, scope, deliverables, milestones, and success criteria.
• Develop and maintain project plans, schedules, budgets, resource forecasts, and risk mitigation strategies.
• Coordinate and lead cross-functional global teams across technology development, design, reliability, manufacturing, quality, and supply chain.
• Select and manage outsourced assembly and test (OSAT) partners to meet qualification objectives.
• Plan test vehicles, define designs, and implement qualification vehicles to support program requirements.
• Define reliability qualification plans, test structures, characterization requirements, and data collection strategies.
• Track qualification metrics, reliability results, budgets, and schedules to ensure technical, quality, cost, and timeline objectives are met.
• Identify, assess, and mitigate technical risks and schedule impacts; drive escalations and resolutions.
• Lead technical and program reviews, milestone readiness assessments, and qualification reviews for release decisions.
• Prepare and present project updates, technical recommendations, risk assessments, and executive summaries to management, customers, and partners.

Requirements

Must-have qualifications and skills.

• Minimum 5 years' experience in semiconductor technology development, packaging, assembly, reliability, qualification, or related roles.
• Proven success leading complex, cross-functional technical projects from concept through qualification and technology release.
• Strong knowledge of semiconductor packaging and post-fab technologies, including bumping, assembly, and package-level testing, and familiarity with OSAT operations.
• Understanding of BEOL process integration and chip-to-package interaction fundamentals.
• Experience defining qualification plans, test structures, characterization requirements, and technology readiness assessments.
• Demonstrated project management skills including schedule, budget, resource, and risk management.
• Strong leadership, communication, stakeholder management, analytical, and problem-solving skills.
• Ability to coordinate global teams and external technology partners in a dynamic development environment.

Nice-to-have:

• Experience with wirebond, flip-chip, wafer-level packaging (WLP), 2.5D/3D integration, TSVs, silicon interposers, or chiplet-based solutions.
• Familiarity with industry qualification and reliability standards such as JEDEC and AEC-Q100.
• Experience working with customers, OSATs, and external technology partners in global manufacturing environments.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline. Preferred certification: PMP or equivalent project management credential.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.