Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

Job Title

Senior Project Manager for Chip-to-Package Interaction (CPI) Qualifications

Role Summary

Lead end-to-end chip-to-package interaction (CPI) qualification programs from concept through qualification and technology release. Work with global, cross-functional teams including technology development, design, reliability, manufacturing, and external assembly/test partners to enable advanced packaging and platform readiness.

This role is based at the GlobalFoundries facility in Malta, New York and focuses on qualification strategy, execution, and delivery of reliability and technology readiness objectives.

Experience Level

Senior-level. Minimum 5 years of experience in the semiconductor industry, preferably in technology development, packaging, assembly, reliability qualification, or related areas.

Responsibilities

Manage CPI qualification programs and coordinate technical and program activities to meet quality, cost, and schedule targets.

• Define CPI qualification strategies, scope, deliverables, milestones, and success criteria aligned with technology objectives.
• Create and maintain project plans, schedules, budgets, resource forecasts, and risk mitigation plans.
• Coordinate and lead cross-functional teams across technology development, design, reliability, manufacturing, quality, and supply chain.
• Select and manage outsourced assembly and test (OSAT) partners to meet qualification timelines.
• Drive test vehicle planning, design definition, and implementation of qualification vehicles.
• Define reliability qualification plans, test structures, characterization needs, and data collection strategies.
• Track qualification metrics, reliability results, budgets, and schedules; conduct milestone readiness assessments and reviews.
• Identify and mitigate technical and schedule risks; lead escalations and resolution.
• Prepare and present project updates, technical recommendations, and executive summaries to management, customers, and stakeholders.

Requirements

Key must-have skills, technologies, and experience for successful performance in this role.

Must-have:

• Minimum 5 years of semiconductor industry experience in technology development, packaging, assembly, reliability qualification, or related areas.
• Proven experience leading complex, cross-functional technical projects from concept through qualification and release.
• Strong knowledge of semiconductor packaging and post-fab processes (bumping, assembly, package-level testing) and OSAT operations.
• Solid understanding of BEOL process integration, chip-to-package interactions, and reliability qualification methodologies.
• Experience defining qualification plans, test structures, characterization requirements, and technology readiness assessments.
• Demonstrated project management skills: schedule, budget, resource, and risk management.
• Strong leadership, stakeholder management, communication, analytical, and problem-solving skills.

Nice-to-have:

• Experience with wirebond, flip-chip, wafer-level packaging, 2.5D/3D integration, TSVs, silicon interposers, or chiplet solutions.
• Familiarity with JEDEC, AEC-Q100, or other industry qualification and reliability standards.
• PMP or equivalent project management certification and prior experience in a global semiconductor manufacturing environment.

Education Requirements

Bachelor's or Master's degree in Electrical Engineering, Materials Science, Physics, or a related technical discipline. Preferred certifications mentioned in the posting include PMP or equivalent project management qualifications.

About the Company

Company: GlobalFoundries

Headquarters: Saratoga Springs, New York, USA

GlobalFoundries is a leading contract manufacturer for the global semiconductor industry, with facilities in multiple countries, including the USA. The company develops a broad portfolio of semiconductor technologies and employs around 13,000 people worldwide. GlobalFoundries focuses on enhancing competitiveness in specialized application solutions and fostering innovation in mobile communications, consumer electronics, and automotive applications.