Senior Program Manager

Job Title

Senior Program Manager

Role Summary

Lead qualification and capacity ramp activities for advanced substrate packaging and wafer assembly within the Advanced Packaging Technology Development (APTD) Substrate and Wafer Assembly team. Work with suppliers, integration teams, and internal stakeholders to deploy EMIB‑T and other substrate technologies for next‑generation AI devices.

This role requires regular onsite presence at supplier factories and frequent travel to supplier sites.

Experience Level

Senior — requires substantial industry experience. Typical experience patterns in the posting: Bachelor's/Master's + 8+ years, or PhD + 4+ years; additionally 6+ years in fab back‑end or substrate manufacturing process development was specified.

Responsibilities

Primary responsibilities focus on supplier qualification, capacity readiness, and production ramp execution.

• Collaborate with on‑site supplier engineering and US integration teams to advance substrate building block technologies and resolve process interactions.
• Drive capacity improvements and reduce throughput time (TPT) for bottleneck processes.
• Manage schedules for product and test vehicle deliveries to meet on‑time delivery (OTD) targets.
• Analyze substrate lead times, create reduction roadmaps, and meet quarterly goals.
• Ensure supplier adherence to Process Control System (PCS) commitments and qualification plans for new factories and tools.
• Develop micro‑schedules and milestone tracking for new factory startups; lead qualification and ramp monitoring to ensure incident‑free production start.
• Influence strategic decisions with senior supplier management and coordinate across cross‑functional internal teams.

Requirements

Concise list of must‑have and preferred qualifications based on the posting.

• Must have: 6+ years of experience in fab back‑end or substrate manufacturing process development.
• Must have: Proven experience working with supplier engineering and cross‑functional teams; ability to travel and be onsite at supplier factories (minimum three days per week).
• Preferred: Experience in capacity management, lead‑time analysis, yield improvement, structured problem solving, and stakeholder/supplier influence.
• Preferred: Hands‑on factory operations, process engineering, substrate manufacturing, and experience qualifying/owning process tools in TD/ramp or HVM contexts.
• Preferred: Strong knowledge of substrate process building blocks (component embedding, laser drilling, dielectric lamination, lithography, multi‑metal plating, inspection/metrology, electrical testing).
• Preferred: Business‑level English communication and presentation skills for engagement with supplier executive management.

Education Requirements

Bachelor's or Master's degree (Science or Engineering) with 8+ years of work experience, or PhD with 4+ years of work experience, in Science or Engineering. The posting also specifies 6+ years of experience in fab back‑end or substrate manufacturing process development as a separate experience requirement.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.