Senior Product Engineer, Package Product Engineering (High Bandwidth Memory)

Job Title

Senior Product Engineer, Package Product Engineering (High Bandwidth Memory)

Role Summary

Lead package and product engineering activities for high-bandwidth memory (HBM) products within the Heterogeneous Integration Group. Drive yield, quality, cost, cycle time and scale through cross-functional collaboration across fab, packaging, test and design teams.

Part of a global product engineering team responsible for manufacturing readiness and next-generation HBM product performance.

Experience Level

Senior — typically 5+ years in the semiconductor industry with product engineering or packaging experience.

Responsibilities

Primary responsibilities focus on yield and quality improvement, root-cause analysis, process conversions, and technical leadership for HBM packaging and assembly.

• Improve assembly yield and reduce Time 0 and field DPM by identifying and preventing inline fallout.
• Optimize HBM cube yields via test coverage, test-flow optimization, and collaboration with technology development and packaging teams.
• Lead cross-functional initiatives to improve cumulative yield and overall product quality.
• Perform electrical failure analysis (EFA) and physical failure analysis (PFA) to identify root causes and drive corrective actions.
• Drive backend process conversions and HVM readiness; recommend process changes to reduce cost and increase yield.
• Coordinate across fab, technology development, package development, design, and quality/reliability teams to deliver products.
• Make technical decisions on risk analysis and project prioritization; manage projects to timely delivery.
• Advocate and deploy AI/ML models to improve KPIs such as quality, cost, cycle time, and scale.

Requirements

Must-have technical skills, collaboration ability, and on-site presence in Singapore.

• Proven problem-solving and root-cause analysis skills, including in-depth circuit analysis.
• Proficiency with statistics, data analysis tools, and scripting for data-driven investigations.
• Demonstrated track record of cross-functional collaboration to address complex engineering problems.
• Strong communication and presentation skills, and a professional work ethic.
• Ability to lead technical programs and develop project management skills.
• Willingness to work on site in Singapore and to travel internationally (Taiwan, US, Japan).
• Nice-to-have: experience with test-flow handling, assembly processes, and advanced packaging.
• Nice-to-have: experience applying ML/AI and automation agents to improve process efficiency.

Education Requirements

Bachelor's or Master's degree in Electrical, Electronic or Mechanical Engineering. The posting specifies more than 5 years of experience in the semiconductor industry; product engineering and packaging experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.