Senior / Principal Silicon Photonic Packaging & Process Engineer

Job Title

Senior / Principal Silicon Photonic Packaging & Process Engineer

Role Summary

Lead development and scale of precision opto-mechanical and electronic assembly processes for silicon photonic LiDAR modules. Collaborate with photonics, mechanical, test teams and contract manufacturers to convert R&D builds into repeatable, high-yield production processes.

Responsible for package design, process definition, qualification at contract manufacturers, yield improvement, and factory scale-up. Position requires up to 25% travel.

Experience Level

Senior — principal-level role. Targeted experience: 10+ years in semiconductor, photonics packaging, or precision opto-mechanical assembly environments.

Responsibilities

Primary responsibilities focused on design-for-manufacturing, process control, and scale-up of precision optical assemblies.

• Design and validate packaging solutions (organic/ceramic substrates, wafer-level, 2.5D/3D) with mechanical, thermal, and electrical trade-offs.
• Define and control automated microlens alignment and bonding processes; program motion sequences and vision routines to achieve sub-micron accuracy.
• Own die placement and die-attach process parameters; correlate placement accuracy, epoxy flow, and bond-line control to optical coupling.
• Develop and control automated epoxy/adhesive dispense recipes; characterize cure profiles and shrinkage impacts on alignment stability.
• Design and execute DOEs and use statistical methods (SPC, Minitab or equivalent) to optimize yield and quantify variability.
• Lead reliability and qualification activities per relevant standards and perform RCCA, FMEA, and DOE planning.
• Define measurement methods and run GR&R studies; ensure metrology and data systems at CMs are calibrated and controlled.
• Drive factory implementation: robotics, automation, material handling, line qualification, operator training, failure analysis, and continuous yield and throughput improvements.
• Collaborate with suppliers and global contract manufacturers to qualify processes and enable high-volume production; support on-site transfers as needed.

Requirements

Core required skills and experience.

• 10+ years hands-on experience in semiconductor, photonics packaging, or precision opto-mechanical assembly environments.
• Experience transferring prototype processes to automation and contract manufacturers; qualifying lines and improving yield.
• CAD modeling and simulation experience; SolidWorks preferred.
• Deep familiarity with automated alignment systems and high-precision die-attach equipment.
• Strong understanding of adhesive dispense physics (viscosity, wetting, cure shrinkage) and related automation equipment.
• Proficiency with DOE methods, SPC, and tools such as Minitab or equivalents.
• Experience leading root-cause analysis, corrective actions, and process FMEAs.
• Excellent cross-functional collaboration and problem-solving skills.
• Willingness to travel up to 25% domestically and internationally.

Nice-to-have:

• Experience with automated micro-optics or fiber alignment and lens-to-PIC coupling.
• Familiarity with micro-electronic assembly processes (die attach, wire bond, hermetic lid sealing, PCBA/SMT).
• Knowledge of cleanroom protocols, ESD control, ISO 9001, or automotive-style quality systems.
• Understanding of photonic packaging materials (epoxies, UV adhesives, underfills) and environmental stability.
• Background in precision metrology (digital microscopes, interferometers, confocal profilers) and FEA for mechanical/thermal simulation.

Education Requirements

Bachelor's or Master's degree in Mechanical, Manufacturing, Photonics, Electrical Engineering, or a related technical field — or equivalent practical experience. The posting explicitly accepts equivalent experience in lieu of a degree.

About the Company

Company: Voyant Photonics

Headquarters: New York, NY, USA

New York City–based company developing compact silicon photonic LiDAR sensors that measure range, velocity, and reflectivity with high accuracy. Uses fingertip-scale silicon photonic chips to produce affordable, high-performance sensors for robotics, autonomous vehicles, drones, industrial automation, and other sensing applications.