Senior Principal IC Design Engineer
NexperiaJob Title
Senior Principal IC Design Engineer
Role Summary
Senior technical lead in the Nexperia IC Solutions logic development team responsible for defining technical requirements and delivering combined IC + plastic package products for high-volume production.
Accountable for full-chip design, family specification and verification, technology selection (CMOS/BCD), and delivering automotive-grade logic and switch families to meet datasheet, customer and quality requirements.
Experience Level
Senior - minimum 10 years of experience in the semiconductor industry and circuit design.
Responsibilities
Lead design and release activities across concept, design, validation and qualification phases and coordinate cross-functional engineering teams.
- Develop and release IC + plastic package products that meet datasheet, customer, industry and quality requirements.
- Serve as technical lead for cross-functional teams (design, product engineering, test, quality).
- Drive full-chip design, family specification, verification and top-level layout for package variants.
- Assess and select cost-effective technologies and technology options (350nm to 110nm CMOS/BCD).
- Develop circuit techniques and implement circuit blocks; define ESD strategy with ESD experts.
- Design family-specific I/O and ESD cells optimized for area and performance.
- Design dies and physical layouts suitable for 4-pin to 24-pin plastic packages with Cu-wire bond wiring.
- Ensure designs meet automotive operating and temperature requirements (-40°C to 125°C).
Requirements
Key must-have skills and experience for successful performance in this role.
- Minimum 10 years of experience in the semiconductor industry and circuit design.
- Deep understanding of semiconductor device physics and device characteristics.
- Proven experience with standard CMOS or BCD technologies.
- Practical knowledge of ESD mechanisms and ESD circuit protection techniques.
- Extensive experience with analog EDA tools and simulation techniques (Cadence or Synopsys).
- Hands-on experience with characterization and lab equipment.
- Ability to work at automotive quality levels and meet temperature and reliability requirements.
- Good written and spoken English communication skills.
Nice-to-have:
- Experience with plastic package technology and assembly (Cu-wire bond).
- Experience designing across very wide operating voltages (0.6V to 15V) and with logic/switch families.
- Experience owning top-level layout fit for multiple packages and die-shrink/redesign projects.
Education Requirements
Master's degree in Electrical Engineering is specified.
About the Company
Company: Nexperia
Headquarters: Cabuyao, Philippines
Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.
