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Senior/Principal Engineer - FE OCT CPEE Photo (EUV/DUV) Process

Micron Technology
September 09, 2026
Full-time
On-site
Taichung, TW
Process Engineering Jobs, Level - Senior

Job Title

Senior/Principal Engineer - FE OCT CPEE Photo (EUV/DUV) Process

Role Summary

Lead high-volume manufacturing (HVM) and new-product introduction (NPI) photolithography process improvements at Taichung Fab 16. Serve as the technical owner for complex lithography issues, align cross-fab/node process standards, and coordinate with internal teams and suppliers to drive yield, quality, productivity, and cost improvements.

Experience Level

Senior/Principal level. Typical experience: 5+ years (Senior) or 8+ years (Principal) in semiconductor photolithography in NPI and HVM manufacturing.

Responsibilities

Primary responsibilities include technical leadership, problem resolution, and deployment of process standards across fabs.

  • Lead HVM photo yield, quality, productivity, and cost improvement initiatives.
  • Perform data-driven root-cause analysis and resolve complex photo process issues (overlay, CDU, EPE, MMM, destack, RWC, yield matching).
  • Define and deploy Photo Process Best Known Methods (BKM) across tools, nodes, and fabs for HVM and NPI.
  • Act as technical point of contact for cross-fab lithography customer concerns and blocking issues.
  • Drive MOR–POR gap closure and cross‑fab/node alignment in collaboration with internal teams and suppliers.
  • Represent OCT Photo in supplier reviews, workshops, and governance forums; influence key suppliers on technical matters.
  • Integrate AI-assisted tools and digital insights to improve analysis, efficiency, and problem solving within the role.

Requirements

Must-have skills and experience to perform the role.

  • 5+ years (Senior) or 8+ years (Principal) experience in semiconductor photolithography in NPI/HVM manufacturing.
  • Hands-on photo process engineering experience focused on yield, quality, productivity, and cost improvement.
  • Proven ability to solve challenges involving overlay, CDU, metrology, reticle correction, MMM, destack, and yield matching.
  • Experience defining and deploying BKMs across tools, nodes, or fabs.
  • Strong data-driven problem-solving and communication skills; able to lead cross-functional, global teams.
  • Willingness to travel for business and accept overseas assignments as required.

Education Requirements

BS, MS, or PhD in Electrical Engineering, Physics, Materials Science, Chemical Engineering, or a related field.


About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

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Date Posted: 2026-09-09