Senior Power Packaging Engineer

Job Title

Senior Power Packaging Engineer

Role Summary

Lead design-for-manufacturability (DFM) and packaging engineering for high-voltage power modules, Power Shelf, and Power Distribution Board (PDB) products. Work across concept, prototype, testing, and transfer to mass production to ensure reliable, cost-effective, high power-density module solutions.

Experience Level

Senior — minimum of 5 years of hands-on experience focused on module-level development, PCB/PCBA DFM, and process engineering.

Responsibilities

Primary responsibilities center on DFM, packaging/process development, and driving products from design through production validation.

• Establish and enforce DFM guidelines for PCB fabrication and PCBA assembly (trace/spacing, vias, impedance, placement, solder mask, stencil design).
• Identify and mitigate manufacturing, testability, and reliability risks during design.
• Lead engineering development of chip-on-board (CoB), system-in-package (SiP), and complex module packages.
• Own process development and qualification for SMT, die attach, wire bonding/flip-chip, underfill, molding, and coating.
• Develop and optimize packaging processes addressing insulation, creepage, thermal, and reliability for medium-to-high voltage environments.
• Participate in prototype building, reliability testing, process verification, and mass production validation; resolve production issues.
• Track and recommend industry packaging technologies and materials to improve performance and cost.

Requirements

Must-have technical skills and experience required for successful performance in this role.

• Expert knowledge of PCB/PCBA design, materials, and fabrication/assembly processes; familiarity with IPC standards.
• Deep understanding of SMT, flip-chip, wire-bond, underfill, and molding processes for advanced packages.
• Experience in structural design, packaging development, and process implementation for Power Shelf, PDB, or similar high-voltage power systems (highly preferred).
• Strong process development capability and experience in soldering, mechanical assembly, and reliability failure analysis.
• Proficiency with mechanical design tools such as SolidWorks or AutoCAD.
• Familiarity with power device packaging (SiC/GaN), potting materials, connector selection, and high power-density assembly processes.
• Minimum of 5 years of relevant hands-on experience in module-level development and process engineering.

Education Requirements

Bachelor’s degree or above in Power Electronics, Mechanical Engineering, Materials Science, Microelectronics Packaging, or related field.

About the Company

Company: Monolithic Power Systems

Headquarters: San Jose, California, USA

Monolithic Power Systems, Inc. (MPS) is a leading provider of energy-efficient power solutions for various applications, including industrial, telecom, automotive, and consumer sectors. Known for their cutting-edge integrated power semiconductors, MPS emphasizes innovation, sustainability, and creativity, making them one of the fastest-growing companies in the semiconductor industry.