Packaging Module Development Engineer

Job Title

Packaging Module Development Engineer

Role Summary

Work on Intel's Advanced Packaging Technology Development team to develop and industrialize advanced IC packaging processes and equipment for Glass Core and CPO platforms. The role focuses on process definition, equipment configuration, characterization, and transfer to manufacturing to meet quality, reliability, cost, yield, and productivity targets.

Experience Level

Mid-level — typically requires 4+ years of relevant industry experience in process development and manufacturing process control.

Responsibilities

Primary responsibilities include developing processes and test capability, characterizing process windows, and improving manufacturability.

• Develop and optimize advanced packaging processes and equipment for Glass Core and CPO technologies.
• Define process specifications, equipment configurations, and manufacturing workflows for new technologies.
• Design and execute experiments (DOE) to characterize process windows and interactions among equipment, materials, and processes.
• Drive improvements in capability, quality, reliability, cost, yield, automation, and productivity.
• Develop and maintain test equipment for thermal, humidity, and mechanical stress conditions representative of field use.
• Collaborate with supplier quality and procurement to validate material specs and vendor performance.
• Lead development of techniques, tools, and methods to accelerate technology readiness and identify early risks.
• Document technical results via reports, white papers, and data analysis.
• Work cross-functionally with engineering teams and external stakeholders to resolve packaging challenges.

Requirements

Must-have technical skills and experience for initial consideration; preferred items listed separately.

• 4+ years experience in process development, equipment adjustment, and manufacturing process control.
• Proven experience with design of experiments (DOE) and statistical data analysis.
• Knowledge of process characterization and statistical process control (SPC) methodologies.
• Experience with material testing and characterization techniques such as DSC, TGA, D/TMA, ICP-MS, FTIR, or SEM.
• Experience troubleshooting integrated technology challenges and applying analytical skills to improve processes.
• Familiarity with advanced statistical tools, process control frameworks, and common office software for data analysis.
• Experience with both organic and inorganic packaging materials; photolithography experience is a plus (approximately 1 year).

Education Requirements

Bachelor's or Master's degree in Mechanical Engineering, Chemical Engineering, Manufacturing/Process Engineering, Materials Science, Physics, Chemistry, or a related technical field is required. Preferred qualifications note Master's with 3+ years or PhD (0 years experience) in similar fields. Equivalent technical experience may be considered where applicable.

About the Company

Company: Intel Corporation

Headquarters: Santa Clara, California, USA

Intel Corporation is a leading multinational technology company known for its innovative semiconductor solutions, including microprocessors, artificial intelligence accelerators, and memory products. Headquartered in the United States, Intel focuses on cutting-edge technology and a collaborative working environment, driving advancements in semiconductor manufacturing to meet global demands. The company emphasizes professional development and aims to shape the future of technology through groundbreaking designs.