Senior Physical Failure Analysis Engineer

Job Title

Senior Physical Failure Analysis Engineer

Role Summary

Join NVIDIA's Physical Failure Analysis team to perform physical failure analysis (PFA) on advanced integrated circuits, deep learning processors, and complex packaged systems. The team investigates root causes of product failures and delivers actionable insights to design, process, and reliability engineering groups.

The role focuses on developing and applying advanced FA techniques, enabling nanoscale diagnostics, and driving reproducible workflows for high-impact failure investigations.

Experience Level

Senior — requires substantial prior hands-on experience; the posting specifies at least 8 years of relevant experience.

Responsibilities

Lead technical failure analysis activities and improve lab capabilities to isolate and resolve critical hardware issues.

• Design and implement advanced FA methodologies for leading-edge silicon and heterogeneous packaging.
• Perform precision sample preparation: mechanical cross-sectioning, de-layering, and chemical/plasma de-processing across die, package, component, and board levels.
• Execute nanoscale analysis using FIB-based sample prep and high-resolution electrical/physical diagnostics.
• Operate and apply optical and electron microscopy (SEM/TEM) and related inspection techniques for defect localization and characterization.
• Lead root-cause investigations and communicate findings to multi-functional engineering teams to support DOE, design optimization, process improvements, and customer requests.
• Develop and validate characterization platforms and robust FA workflows to improve laboratory efficiency and reproducibility.

Requirements

Must-have technical skills and domain experience required to perform the role effectively.

• Deep practical knowledge of semiconductor IC fabrication, advanced packaging/assembly processes, and failure analysis methodologies.
• Proven proficiency in precision IC device sample preparation and targeted defect localization techniques.
• Hands-on expertise with SEM, TEM, FIB sample preparation and analysis, and other microscopy/inspection methods.
• Demonstrated system-level analysis capability across die, package, component, and board levels.
• Ability to lead investigations, prioritize tasks in fast-paced settings, and deliver clear technical reports to engineering stakeholders.
• Strong problem-solving skills, attention to detail, and experience improving laboratory workflows and characterization platforms.
• Nice-to-have: experience with advanced packaging schemes for high-performance processors and familiarity with electrical diagnostics techniques.

Education Requirements

B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, Chemistry, or a closely related field — or equivalent practical experience.

About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.