Senior Photonics Packaging Engineer

Job Title

Senior Photonics Packaging Engineer

Role Summary

Lead the design, development, and integration of lasers, PICs, SOAs, and other photonic components into high-performance optoelectronic modules. Work with cross-functional engineering teams to develop packaging architectures, alignment strategies, and processes for production.

Experience Level

Senior — the posting requests experienced engineers; the role specifies 5+ years of hands-on photonics packaging experience.

Responsibilities

Key responsibilities include:

• Design and develop photonic packaging solutions for lasers, PICs, SOAs, and other optical components.
• Lead optical, mechanical, and thermal co-design for high-density optoelectronic assemblies.
• Drive active and passive alignment strategies for sub-micron precision in fiber and chip coupling.
• Develop and validate photonic interconnect technologies such as photonic wire-bond, co-packaged optics, and fiber connectors.
• Perform DFM and transfer packaging processes to volume production; qualify materials and processes.
• Collaborate with R&D, process, reliability, and test engineering to optimize packaging architecture.
• Author design specifications, process flows, and test protocols.

Requirements

Required technical skills and preferred additions:

• Must-have: 5+ years of hands-on experience in photonics packaging with focus on laser, PIC, and SOA heterogeneous integration.
• Must-have: Deep understanding of optical coupling techniques, waveguide interfaces, and photonic device behavior.
• Must-have: Experience with cleanroom processes, micro-assembly, and fiber attach.
• Must-have: Proficiency with CAD tools (SolidWorks), optical simulation software (Lumerical, Zemax), and thermal modeling tools.
• Must-have: Strong problem-solving skills and ability to operate in a fast-paced, collaborative environment.
• Nice-to-have: Experience with silicon photonics or InP platforms.
• Nice-to-have: Familiarity with high-speed optical transceivers and telecom/datacom standards.
• Nice-to-have: Background in automated packaging systems, precision robotics, RF packaging, and signal integrity considerations.

Education Requirements

Required: Bachelor's or Master's degree in Electrical Engineering, Optical Engineering, Physics, or a related field.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.