Senior Photonics Packaging Engineer

Job Title

Senior Photonics Packaging Engineer

Role Summary

Lead the design, development, and integration of lasers, PICs, and SOAs into high-performance optoelectronic modules. Work with R&D, process, reliability, and test teams to develop wafer-level packaging, precise alignment, and manufacturable processes for next-generation optical communication systems.

Experience Level

Senior-level; requires 5+ years of hands-on experience in photonics packaging and heterogeneous integration.

Responsibilities

Accountabilities include end-to-end photonic packaging from concept and validation through transfer to production.

• Design photonic packaging solutions for lasers, PICs, SOAs, and associated optical components.
• Lead optical, mechanical, and thermal co-design for high-density optoelectronic assemblies.
• Develop and implement active and passive alignment strategies for sub-micron fiber and chip coupling.
• Develop and validate photonic interconnect technologies (photonic wire-bond, co-packaged optics, fiber connectors).
• Perform DFM and transfer packaging processes to volume production.
• Evaluate and qualify materials, processes, and interconnects for reliability and manufacturability.
• Collaborate with R&D, process, reliability, and test engineering to optimize packaging architecture.
• Author design specifications, process flows, and test protocols.

Requirements

Must-have hands-on skills and tools for the role. Education is summarized separately below.

• 5+ years in photonics packaging with experience in laser, PIC, and SOA heterogeneous integration.
• Deep understanding of optical coupling techniques, waveguide interfaces, and photonic device behavior.
• Experience with cleanroom processes, micro-assembly, and fiber attach.
• Proficiency with CAD tools (SolidWorks), optical simulation software (Lumerical, Zemax), and thermal modeling tools.
• Strong problem-solving skills and ability to work in a fast-paced, collaborative environment.

Preferred:

• Experience with silicon photonics or InP platforms.
• Familiarity with high-speed optical transceivers and telecom/datacom standards.
• Background in automated packaging systems and precision robotics.
• Knowledge of RF packaging and signal integrity considerations.

Education Requirements

Bachelor's or Master’s degree in Electrical Engineering, Optical Engineering, Physics, or a related field.

About the Company

Company: Xscape Photonics

Headquarters: Santa Clara, California, United States

Developer of integrated photonics solutions and instrumentation, specializing in photonic circuits, control systems, and test methodologies for optical communication and sensing applications. Works on device integration, control algorithms, and validation of photonic hardware and firmware.