Senior Packaging Technical Engineer - Hardware
Design and implement silicon pad rings, substrate interconnect schemes, and package layout for electrical package solutions. The role works across chip floor planning, pad ring definition, substrate and ball-out implementation to ensure robust electrical and signal integrity performance.
Collaborate closely with circuit, signal integrity, RTL, place-and-route, substrate layout, and system design teams to deliver production-ready package solutions.
Senior β typically 8+ years of relevant experience in board or system design.
Core responsibilities include defining chip/package interfaces and driving package layout and electrical design.
Key technical and professional requirements.
Must-have:
Nice-to-have:
BSEE or equivalent practical experience (the posting explicitly allows equivalent experience in lieu of the degree).
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
