Senior Packaging Technical Engineer - Hardware
Design and implement silicon pad rings, substrate interconnect schemes, and lead package layout for advanced silicon packages. Work across multiple package technologies and collaborate with circuit, signal integrity, RTL, place-and-route, substrate layout, and system engineers.
Senior — minimum 8+ years of experience in board or system design; demonstrated experience working on complex electronic packaging or related hardware design projects.
The role owns package electrical design elements and coordinates across engineering teams.
Technical and professional requirements. Items labeled as "Preferred" are not strict must-haves.
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
