Senior Packaging Technical Engineer - Hardware
Lead design and delivery of electrical package layouts for GPU products, including pad ring, substrate interconnect, and ball-out. Work within hardware and packaging teams and collaborate with circuit, signal integrity, RTL, place-and-route, substrate layout, and system engineers to produce robust power and signal solutions.
Senior-level. Requires approximately 8+ years of board or system design experience.
Key responsibilities include:
Core requirements and desirable skills.
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
