Senior Packaging Technical Engineer - Hardware
Senior engineer responsible for defining and implementing chip pad rings, substrate interconnect schemes, and leading package layout design for complex semiconductor packages.
Works across multiple engineering teams (circuit, SI, RTL, P&R, substrate layout, system) to deliver robust electrical package solutions.
Senior β the role expects experienced engineers. The posting specifies a minimum of 8+ years of board/system design experience.
Key responsibilities include:
Must-have skills and experience:
Bachelor of Science in Electrical Engineering (BSEE) or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
