Senior Packaging Engineer

Job Title

Senior Packaging Engineer

Role Summary

Lead IC packaging from concept through manufacturing and ramp-up for Arago's photonic and semiconductor devices. Work cross-functionally with IC design, optical, and PCB teams to define packaging specifications, ensure manufacturability, and achieve production targets.

Establish supply chain, manage subcontractors, and drive NPI and industrialization for current and future products.

Experience Level

Senior — minimum 5+ years in the semiconductor and photonic packaging industry.

Responsibilities

Deliver packaging solutions and lead industrialization and supplier management.

• Design packaging solutions from initial drawings and simulations through DFM validation.
• Lead NPI, manufacturing process selection, and ramp-up for new devices.
• Identify, vet, and manage external subcontractors and suppliers.
• Collaborate with IC design, optics, and PCB teams to align cross-domain specifications.
• Drive yield improvement and process control to meet Cpk and production targets.
• Conduct failure analysis, debugging, and root-cause investigations.

Requirements

Essential technical skills and experience required; optional items noted.

• 5+ years experience in semiconductor and photonic packaging.
• Proven experience with heterogeneous integration and packaging processes: wafer dicing (stealth, blade, diamond scribing), high-density Cu pillars and advanced bumping, flip-chip, redistribution layer, and encapsulation (thermal lid, compression molding, glob-top).
• Hands-on experience with die attach and bonding techniques (epoxy, attach film, reflow, thermocompression, eutectic, laser-assisted bonding, Cu-Cu direct bonding) and wirebonding.
• Experience with 2.5D/3D integration schemes: back grinding, TSV reveal, die stacking, and interposer technologies.
• Expertise in photonic/optoelectronic packaging and micro-scale optical alignment, including passive/active alignment of lenses and fibers and fine die placement (<1 µm); experience with InP, GaAs, and other non-Si materials.
• Proficiency in thermal, mechanical, and electromagnetic simulation tools.
• Experience with production flows, industrialization, high-yield manufacturing, and failure analysis; Six Sigma/statistical process control is a plus.
• English proficiency required; French is a plus.

Education Requirements

Master's degree in Electrical Engineering or Integrated Circuits Design required.

Pay and Benefits

Competitive cash compensation (location- and experience-dependent); meaningful stock option plan; relocation support for moves within 20 minutes of the company location; healthcare and pension contributions; 25 days PTO plus public holidays; professional development support; 50% reimbursement of public transport subscription.

About the Company

Company: Arago

Arago is an AI and computer hardware startup (founded 2024) developing AI-driven semiconductor and photonics solutions. The company brings together engineers and researchers in photonics, electronics, software, mathematics, and machine learning to accelerate prototype-to-silicon development across hubs in France, North America, and Israel.