Senior Packaging Engineer

Job Title

Senior Packaging Engineer

Role Summary

Join Qorvo's Packaging Modeling Team in Barcelona to develop and advance simulation methodologies for semiconductor packages. The role focuses on thermal, mechanical and thermo-mechanical finite element analysis to improve reliability, performance and cost across diverse package types.

This is an onsite position based in Barcelona with an expectation to be in the office five days a week. You will collaborate with global cross-functional teams and support business units with mechanical engineering expertise.

Experience Level

Senior / Professional. No explicit years-of-experience stated.

Responsibilities

Primary responsibilities include simulation, methodology development, and cross-functional support.

• Perform thermal, mechanical, and thermo-mechanical FEA/FEM simulations for various devices and package types.
• Develop and refine simulation methodologies to improve accuracy and reduce run time.
• Identify quality and reliability risks and propose engineering solutions.
• Optimize model size, detail and automated generation to shorten simulation cycles.
• Support business units with mechanical engineering and packaging expertise.
• Collaborate with global teams to drive packaging technology improvements.

Requirements

Core technical and professional requirements. Education requirements are listed separately below.

• Strong understanding of thermal physics and thermal processes relevant to semiconductor packaging.
• Experience using FEA/FEM simulation tools and workflows.
• Excellent presentation and written/verbal communication skills; able to present technical results clearly.
• Proven ability to work effectively in a global, collaborative environment.
• Proficiency in packaging and semiconductor technologies.
• Fluent in English.
• Work authorization: candidates must have legal status to work in Spain.

Nice-to-have

• Hands-on experience with Ansys Mechanical.
• Background in packaging, mechanical/materials engineering, or reliability engineering with emphasis on simulation or process optimization.
• Basic knowledge of RF circuit design.

Education Requirements

Ph.D. in Physics, Mechanical Engineering, Electrical Engineering, Material Science, or a related technical field is required. Related fields are acceptable as specified in the posting.

About the Company

Company: Qorvo

Headquarters: Greensboro, NC, US

Qorvo supplies innovative semiconductor solutions that enhance connectivity and power for a variety of applications, including consumer electronics, automotive, and healthcare. With a focus on RF and power solutions, Qorvo combines technology leadership and global manufacturing to address complex challenges in fast-growing industries. Their commitment to excellence and innovation drives them to shape the future of wireless communications.