Senior Packaging Engineer

Job Title

Senior Packaging Engineer

Role Summary

Join the Silicon Manufacturing and Product Engineering (SMPE) team supporting design, qualification, and high-volume manufacturing of Microsoft cloud silicon packaging. The role focuses on driving package development, supplier/OSAT management, production ramp readiness, quality, and reliability.

Work with cross-functional teams across silicon, package, test, quality, manufacturing, and system engineering to transition advanced package technologies from development into production.

Experience Level

Senior - requires significant industry experience in semiconductor packaging, manufacturing, and supplier management. Specific years of experience not stated.

Responsibilities

Primary responsibilities cover package development, production ramp, high-volume manufacturing support, and supplier quality management.

• Lead package development through engineering builds, qualification, and production ramp; define manufacturing specifications, process requirements, and readiness criteria.
• Manage OSAT technical engagement: process reviews, development checkpoints, readiness assessments, and technical audits.
• Monitor manufacturing and test-vehicle data to identify package/process risks and accelerate learning during development.
• Drive structured ramp management to ensure technology readiness, process capability, yield, quality, and capacity for volume production.
• Provide technical oversight of OSAT and supplier performance; monitor yield, process health, quality indicators, and manufacturing excursions.
• Lead root-cause analysis and corrective/preventive actions for yield, quality, and reliability issues; implement excursion prevention and containment.
• Support product change management and technical risk assessments for manufacturing changes.
• Establish supplier technical checklists, audit criteria, and ongoing manufacturing health reviews; conduct onsite supplier assessments and audits.

Requirements

Must-have technical skills and security/export-screening requirements are listed below. Education requirements are summarized separately under "Education Requirements."

• Significant industry experience in semiconductor packaging, assembly, process engineering, package development, or manufacturing.
• Proven track record taking advanced package technologies from development through qualification to high-volume production.
• Direct experience working with OSATs and external manufacturing partners; supplier technical management and audits.
• Strong analytical skills for yield analysis, process capability assessment, root-cause analysis, and corrective actions.
• Experience with package architecture, assembly technologies, materials, process integration, and manufacturing controls.
• Experience with package reliability, failure mechanisms, and design-for-manufacturing/design-for-reliability principles.
• Strong communication and cross-functional leadership skills to influence suppliers and internal teams.
• Ability to meet Microsoft Cloud Background Check and periodic security screening requirements.
• Must satisfy export-control documentation requirements (citizenship or residency proof) to access controlled information where applicable.

Education Requirements

BS, MS, or PhD in Materials Science, Mechanical Engineering, Electrical Engineering, Chemical Engineering, Packaging Engineering, or a related technical discipline (or equivalent technical education and experience).

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.