Senior Packaging Engineer

Job Title

Senior Packaging Engineer

Role Summary

Lead development and transfer of advanced integrated circuit (IC) packaging technologies into high-volume manufacturing for products including Data Center, AI, Power Management and Compute. The role sits in Packaging Engineering and coordinates across internal design, modeling, procurement teams and external OSATs, substrate/material suppliers, and tool vendors.

Primary mission: define package process flows, materials, design-for-manufacturability, and reliability qualification to deliver manufacturable, cost-effective packaging solutions.

Experience Level

Senior — typically 8+ years of experience in development and high-volume manufacturing of advanced IC packages.

Responsibilities

Accountable for technical leadership of packaging technology development and transfer.

• Develop and deploy FCCSP, FCBGA, SiP/module and related packaging technologies for high-volume manufacturing.
• Define package process flows, material sets, Best Known Methods (BKM), test vehicles, DOEs, cornering and process control plans.
• Interface with OSATs, substrate/material suppliers and tool makers to align technology with product requirements and design rules.
• Promote Design for Manufacturability (DFM) with internal design teams and implement cost-effective packaging solutions.
• Manage technical programs: planning, execution, monitoring, and status reporting to management and cross-functional teams.
• Apply FMEA, SPC/QC, failure analysis and quality-issue resolution to ensure manufacturing reliability.

Requirements

Must-have technical skills and behaviors for immediate success in the role.

• Proven experience developing and transferring advanced IC packages (Flip Chip, Wire Bond, FCCSP, FCBGA, SiP) into high-volume manufacturing.
• Deep knowledge of packaging materials, assembly processes, equipment, and package design rules.
• Experience working directly with OSATs, substrate and material suppliers, and equipment/tool vendors.
• Strong skills in DFM, failure analysis, statistical process control and manufacturing floor operations.
• Demonstrated technical program management and ability to lead multi-functional teams.
• Excellent verbal and written communication and ability to work independently across multiple programs.
• Nice-to-have: wafer-on-wafer bonding, Laser Groove technology, reliability test & qualification experience, material/package characterization and statistical data analysis, Six Sigma certification.

Education Requirements

Bachelor's degree in Electrical, Chemical, Mechanical Engineering, Materials Science or related engineering field (preferred) or equivalent practical experience. The posting also lists Master's degree or PhD in those fields as preferred. Six Sigma Green/Black Belt noted as a plus.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.