Senior Package Reliability Engineer

Job Title

Senior Package Reliability Engineer

Role Summary

Characterize and qualify advanced 2.5D/3D semiconductor packages. Partner with package development, assembly, and manufacturing teams to select materials, develop thermal and thermomechanical models, and validate package reliability for FPGA products.

Experience Level

Senior — typically requires 8+ years of relevant experience in semiconductor package thermal and thermomechanical analysis.

Responsibilities

Lead reliability characterization, modeling, and qualification activities for advanced semiconductor packages.

• Partner with package development and assembly teams to select substrate and assembly materials to meet thermomechanical reliability requirements.
• Develop and maintain thermal and thermomechanical finite element models using commercial tools (e.g., Ansys, Abaqus).
• Define, execute, and interpret data collection strategies for coplanarity, warpage, and second-level reliability to calibrate FEM models.
• Lead package reliability evaluations and qualification testing per industry standards (JEDEC, MIL-STD, IPC, AEC).
• Perform lifetime prediction modeling from stress-test and field data; support failure analysis.
• Prepare customer-facing reports and communications on package thermal and thermomechanical issues.
• Develop and own package DFMEA/FMEAs in collaboration with development and manufacturing teams.

Requirements

Must-have technical skills, experience, and tools.

• Must-have: 8+ years of experience in semiconductor package thermal and thermomechanical analysis.
• 8+ years using thermal and thermomechanical simulation tools (e.g., Ansys, Abaqus, COMSOL, or equivalent).
• 8+ years developing, analyzing, and validating advanced packaging technologies including 2.5D, 3D, and heterogeneous integration.
• 3+ years applying reliability statistics, failure analysis methodologies, and lifetime modeling techniques to packaging and product reliability assessments.
• 3+ years developing scripts or software using Python for automation, simulation workflows, data analysis, and post-processing.
• Experience validating package robustness and correlating simulations with test and assembly behavior.

• Nice-to-have: Deep understanding of thermal, mechanical, and thermomechanical characteristics of 2.5D/3D flip-chip packages.
• Experience correlating thermomechanical simulations with dynamic warpage and surface-mount system-level assembly behavior.
• Experience preparing customer-facing materials for packaging risk assessments.

Education Requirements

Master's degree in Mechanical Engineering, Materials Science, Packaging Engineering, or a related technical field. (Minimum qualifications specify a Master's degree plus 8+ years of relevant experience.)

About the Company

Company: Altera

Headquarters: Bengaluru, Karnataka, India

Altera provides leadership programmable solutions for applications ranging from cloud to edge, unveiling limitless AI possibilities. Their extensive product portfolio includes FPGAs, CPLDs, Intellectual Property, development tools, and System on Modules aimed at accelerating innovation in various fields.