Senior Package Product Solutions Engineer

Job Title

Senior Package Product Solutions Engineer

Role Summary

Design and implement semiconductor packaging products, structures, and assembly process technologies. Work within Package Innovation teams to develop solutions from concept through qualification and transfer to manufacturing.

Collaborate with internal assembly sites and external OSATs to resolve materials and processing issues, qualify package solutions, and investigate emerging packaging technologies for production use.

Experience Level

Senior. The posting specifies a senior-level role; years of experience were not listed.

Responsibilities

The role focuses on packaging product development, cross-functional collaboration, and implementation into manufacturing.

• Design, develop, execute, and implement packaging products, structures, and assembly process technologies.
• Identify and resolve materials and process issues during development and qualification.
• Work closely with Design, Materials, Modeling (electrical/thermal/mechanical), and Package Processing teams to develop integrated solutions.
• Manage projects using standard project-management tools and practices.
• Collaborate with internal assembly sites and OSAT partners to qualify package solutions for production.
• Evaluate feasibility of emerging packaging technologies and drive implementation into manufacturing.
• Maintain state-of-the-art technical knowledge; contribute to publications, conferences, and patent filings when appropriate.
• May involve international travel to assembly sites and suppliers.

Requirements

Core technical and interpersonal skills required to perform the role.

• Proven experience in semiconductor packaging development and troubleshooting of materials/process issues.
• Strong collaboration skills across design, materials, modeling, and processing teams.
• Familiarity with project management tools and ability to manage technical projects.
• Excellent written and verbal communication and presentation skills; team player and self-driven.
• Ability to work in a fast-paced, dynamic environment and adapt to changing priorities.
• Willingness and ability to travel internationally as required.
• Nice-to-have: experience with modeling interactions (electrical/thermal/mechanical), contribution to patents or technical conferences.
• Nice-to-have: knowledge of statistical analysis and design of experiments (DOE).
• Nice-to-have: experience working with external OSATs and assembly site qualification processes.
• Nice-to-have: familiarity with various IC package types and advanced fan-out/wafer-level packaging technologies.

Education Requirements

M.S. or Ph.D. in Materials Science, Mechanical Engineering, Chemical Engineering, or Electrical Engineering.

About the Company

Company: NXP Semiconductors

Headquarters: Nijmegen, Netherlands

NXP Semiconductors N.V. is a global semiconductor company that provides High Performance Mixed Signal and Standard Product solutions. With over 45,000 employees and operations in more than 35 countries, NXP is a leader in secure connectivity solutions for embedded applications, catering to automotive, industrial IoT, mobile, and communication infrastructure markets. The company is committed to innovation and sustainability, advancing a smarter, safer, and more sustainable world through technology.