Senior Package Modeling Engineer
Work in NVIDIA's Advanced Technology Group (ATG) developing and validating thermo-mechanical models for advanced semiconductor packages. The role focuses on using FEA to assess stress, warpage, and reliability and to influence package build, material selection, and manufacturing decisions.
The position collaborates with cross-functional teams to define modeling approaches, interpret simulation results, and contribute to long-term packaging roadmaps.
Senior β typically requires 5+ years of relevant experience in FEA modeling/simulation or equivalent.
Primary responsibilities include:
Must-have skills and experience:
MS or PhD in Mechanical Engineering, Materials Science, or a related field β or equivalent practical experience.
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
