Senior Package Modeling Engineer
NVIDIAJob Title
Senior Package Modeling Engineer
Role Summary
Senior engineer on NVIDIA's Advanced Technology Group focused on modeling and simulation of advanced semiconductor packages to drive reliability and performance. The role supports package development by defining modeling approaches, interpreting simulation results, and guiding material and process decisions.
Work is cross-functional with designers, materials, and manufacturing teams to ensure robust package builds and to influence long-term packaging technology direction.
Experience Level
Senior — typically requires 5+ years of FEA modeling/simulation experience.
Responsibilities
Principal responsibilities include simulation, analysis, and technical guidance for advanced package reliability.
- Perform finite element analysis (FEA) to assess stress, warpage, and thermo-mechanical behavior across semiconductor packaging platforms.
- Evaluate new materials, interconnect concepts, and process options and contribute to packaging technology roadmaps.
- Analyze material properties and quantify their impact on package reliability and failure modes.
- Establish modeling approaches and assumptions; interpret simulation outputs and provide actionable recommendations for package build and manufacturing.
- Provide practical mentorship to engineering teams on modeling results, material selection, and manufacturing implications.
- Collaborate with cross-functional teams and document modeling methodologies and findings for internal stakeholders.
Requirements
Essential technical skills and experience required for immediate contribution.
- 5+ years of FEA modeling/simulation experience.
- Proficiency with FEA tools such as ANSYS, Abaqus, COMSOL, or equivalent.
- Knowledge of thermo-mechanical interactions and reliability failure modes in semiconductor packages.
- Familiarity with JEDEC reliability standards and accelerated life testing methods.
- Practical understanding of advanced packaging architectures and materials (flip-chip, 2.5D/3D IC, CoWoS-R, CoWoS-L, advanced substrates).
- Strong problem-solving, analytical, and communication skills; ability to document and present technical results.
Education Requirements
MS or PhD in Mechanical Engineering, Materials Science, or a related field, or equivalent practical experience.
About the Company
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
