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Senior Package Layout Engineer

Arm
September 04, 2026
Full-time
On-site
Chandler, Arizona, United States
$161,500 - $218,500 USD yearly
Other Semiconductor Jobs, Level - Senior

Job Title

Senior Package Layout Engineer

Role Summary

Design and verify IC package layouts for Arm's System-in-Package team, implementing next-generation SoCs for IoT, Automotive, and Compute applications. Deliver package routing, stack-up, power distribution, and signal integrity solutions to meet size, cost, and system-performance targets.

Work collaboratively with geographically distributed engineering teams (France, US, UK and other Arm sites) and contribute to standardization and methodology improvements for the layout team.

Experience Level

Senior. The posting specifies 3–5 years of recent hands-on experience with Cadence APD & Allegro toolsets as guidance for relevant experience.

Responsibilities

Primary duties include:

  • Develop IC package layouts using best practices for high-speed signaling and high-power devices.
  • Implement package routing, stack-up creation, reference planes, and power distribution using Cadence APD or SiP tool suites.
  • Conduct feasibility studies evaluating package build goals for size, cost, and system performance.
  • Independently resolve complex design problems and adapt to changing requirements.
  • Provide guidance and feedback on methodologies to improve layout team efficiency and drive standardization.

Requirements

Must-have skills and experience:

  • Experience with 2.5D and 3D package systems and their signal-integrity / power-integrity requirements.
  • 3–5 years recent experience using Cadence APD and Allegro toolsets.
  • Proven ability to work independently and resolve complicated design issues.
  • Experience implementing package routing, stack-up and power distribution planning.
  • Awareness of methods that drive standardization and improve departmental efficiency.

Nice-to-have:

  • Familiarity with EDA vendor collaboration, tool evaluation, and issue resolution.
  • Good verbal and written communication and presentation skills.
  • Experience working in large, geographically dispersed teams.
  • Experience optimizing packaging design methodologies.

Education Requirements

Bachelor's degree in Electrical Engineering or equivalent practical work experience.


About the Company

Company: Arm

Headquarters: Cambridge, United Kingdom

ARM is a global leader in semiconductor and software design, driving innovation in computing technology. The company specializes in designing processors and systems that provide the essential building blocks for electronic devices. ARM's architecture is widely used in smartphones, servers, and IoT devices, and its collaborative culture fosters bold thinking, diversity, and high-impact benefits for its talented workforce.

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Date Posted: 2026-09-03