Senior Package Layout Engineer

Job Title

Senior Package Layout Engineer

Role Summary

Join the R&D hardware design team within the Signal Integrity Products business unit to develop high-speed package and PCB layouts for advanced interconnect technologies. The role supports feasibility assessments, multi-layer substrate and carrier layouts, and wafer-level interconnect designs for 2D, 2.5D and 3D IC configurations.

Experience Level

Senior-level. Minimum 5 years of layout experience in high-speed package and/or advanced PCB technologies.

Responsibilities

Work across engineering and manufacturing teams to design and deliver package and PCB layouts that meet signal-integrity, mechanical, thermal, and fabrication requirements.

• Perform package design feasibility assessments in collaboration with signal-integrity, manufacturing, and thermo-mechanical teams.
• Develop multi-layer substrate and carrier layouts for 2D, 2.5D, and 3D IC configurations.
• Develop wafer-level interconnect layouts using redistribution layers and wafer reconstruction techniques.
• Coordinate with internal cross-functional teams and external suppliers to move designs to fabrication.
• Troubleshoot and iterate on PCB and system-level issues to meet performance and reliability targets.

Requirements

Must-have technical skills and experience for immediate contribution. Desired items summarize helpful additional qualifications.

• Must-have: 5+ years of layout experience in high-speed package and/or advanced PCB technologies.
• Must-have: Solid knowledge of high-speed layout, signal integrity, and electronic design practices.
• Must-have: Advanced proficiency with EDA layout tools.
• Must-have: Familiarity with PCB layout and with mechanical, thermal, and optical design considerations.
• Must-have: Understanding of RF, analog, and digital circuit behavior relevant to layout.
• Must-have: Strong communication skills and ability to coordinate with local and international suppliers and cross-functional teams.
• Must-have: Ability to work independently in a fast-paced environment.
• Nice-to-have: Advanced knowledge of Cadence APD and Mentor/Siemens Allegro.
• Nice-to-have: Experience with AI design-acceleration features in EDA tools.
• Nice-to-have: Familiarity with interconnect configurations (chip-on-board, wirebond, flip-chip, optical assembly, high-speed connectors) and industry standards such as JEDEC and IPC.

Education Requirements

Bachelor's degree in engineering, physics, or a related technical discipline is required. Preferred qualifications mention additional degrees or certifications (e.g., advanced degrees or certifications in mechatronics, photonics, or electronics manufacturing). The posting does not explicitly state an "equivalent experience" clause for the degree requirement.

About the Company

Company: Semtech

Headquarters: Camarillo, California, USA

Semtech Corporation is a high-performance semiconductor company providing IoT systems and Cloud connectivity solutions. The company focuses on delivering innovative technology solutions that support a smarter, more connected, and sustainable planet, with a dedication to quality across infrastructure, industrial, and consumer markets.