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Senior Package Design Engineer – Semiconductor Packaging

Leoforce
July 29, 2026
Full-time
Remote friendly (Santa Clara, California, United States)
Worldwide
$150,000 - $300,000 USD yearly
Other Semiconductor Jobs, Level - Senior

Job Title

Senior Package Design Engineer – Semiconductor Packaging

Role Summary

Support early-stage semiconductor package development with a focus on package–board co-design. Develop PCB routing studies, board-level mockups, and electrical modeling collateral to optimize package architecture, BGA implementation, and system-level performance.

Work closely with package, signal integrity (SI), power integrity (PI), mechanical, and systems teams. Role is based in Santa Clara, CA with a hybrid schedule and minimal travel.

Experience Level

Senior-level (posting lists role as Senior). No specific total years of experience requirement beyond the technical experience noted in Requirements.

Responsibilities

Primary responsibilities include board- and package-level design activities to enable early architecture decisions and electrical validation.

  • Create PCB routing studies supporting package development
  • Develop board-level design mockups for electrical modeling
  • Perform package escape routing and BGA optimization studies
  • Analyze routing congestion and layer utilization
  • Support signal integrity and power integrity modeling efforts
  • Build representative PCB environments for package evaluation
  • Collaborate with package, SI/PI, mechanical, and systems engineering teams
  • Evaluate design tradeoffs during early architecture phases
  • Contribute automation and workflow improvement initiatives
  • Support advanced package–board co-design activities

Requirements

Must-have technical skills and experience.

  • 3+ years using Cadence Allegro PCB Designer
  • Experience with high-pin-count BGA layouts
  • Strong PCB routing expertise and knowledge of package escape strategies
  • Understanding of signal integrity fundamentals
  • Understanding of power integrity fundamentals
  • Experience with complex, high-speed interconnects
  • Strong cross-functional communication skills
  • Ability to work through ambiguous engineering challenges
  • Interest in AI-driven engineering automation

Education Requirements

Not specified.


About the Company

Company: Leoforce

Recruiting and talent-acquisition firm that sources and places engineering and technology talent, often handling job postings and staffing for semiconductor and AI companies.

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Date Posted: 2026-07-27