Senior Package Design Engineer

Job Title

Senior Package Design Engineer

Role Summary

Design and deliver advanced semiconductor packages (2.5D/3D, chiplet-based, FCBGA, SiP, wire bond, QFP/QFN) by executing package layout, maintaining CAD databases, and ensuring manufacturability. The role works within an advanced silicon packaging design and simulation team and collaborates with silicon, SI/PI, thermal, reliability, and manufacturing partners to bring designs to production.

Experience Level

Senior-level. Minimum 6+ years of hands-on package CAD layout and development experience as stated in the posting.

Responsibilities

Execute package design tasks across the full design cycle and support cross-domain co-design and manufacturability.

• Perform package layout design for 2.5D/3D ICs, FCBGA, SiP, multi-die and chiplet-based modules.
• Develop and maintain package CAD databases; enforce design guidelines, DFM, and DFA for producibility.
• Create schematics, import netlists, assign footprints, and generate manufacturing outputs (Gerbers, drill data, assembly/fabrication drawings).
• Create and modify substrate/RDL layouts, bump maps, escape routing, and power/ground structures.
• Work with SI/PI, thermal, reliability, DFT teams and participate in design reviews to support co-design and optimization.
• Ensure compliance with foundry, OSAT, and manufacturing design rules (DRC, LVS).
• Support ECO cycles, design updates, and version control during project lifecycle.

Requirements

Key technical qualifications and skills required for successful performance in this role.

• Must-have: 6+ years hands-on package CAD layout and development experience.
• Must-have: Experience with 2.5D/3D IC packaging, FCBGA and advanced substrate-based packages, multi-die and chiplet designs.
• Must-have: Proficiency with industry tools such as Cadence Allegro Package Designer (APD/SiP), Siemens Xpedition/Innovator 3D IC, or equivalent.
• Must-have: Experience with advanced manufacturing design rules and interfacing with OSATs; ability to produce manufacturing deliverables (Gerbers, drill data, drawings).
• Must-have: Solid understanding of Signal Integrity (SI), Power Integrity (PI), and high-speed design fundamentals.
• Must-have: Strong communication, presentation, and documentation skills; ability to work in cross-functional teams.
• Nice-to-have: Experience with thermal and reliability co-design, DFT collaboration, and complex power/ground planning.

Education Requirements

Not specified.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.