Senior Package Architect

Job Title

Senior Package Architect

Role Summary

Lead development, qualification, and implementation of new semiconductor package technologies, processes, and materials for power-package applications. Work with internal manufacturing sites, subcontractors, cross-functional teams, and business groups to deliver robust, manufacturable packaging solutions that meet quality, reliability and schedule targets.

Experience Level

Senior-level. Specific years of experience not specified.

Responsibilities

The role focuses on technical leadership across package development, qualification, supplier assessment, and cross-functional integration.

• Develop, qualify and introduce new package technologies, processes and materials for power packages.
• Assess and recommend subcontractors via technical evaluations and RFQs; maintain subcontractor package portfolios and roadmaps.
• Perform package and process integration risk assessments and review DOEs, engineering evaluations and mitigation plans.
• Monitor qualification plans, process evaluations and process freeze activities through technical reviews and Gemba.
• Drive failure analysis, root-cause investigations and corrective actions to resolve reliability and quality issues.
• Prepare and present technical reports, papers and engineering documentation; support IP generation (invention disclosures, patents).
• Benchmark internal and subcontractor capabilities (technologies, equipment, materials, design rules) and align stakeholders.
• Support project execution to meet KPIs: schedule, qualification success, quality performance and IP targets.
• Travel primarily within Asia and occasionally to Europe to support development projects and supplier assessments.

Requirements

Key technical skills, methodologies and interpersonal capabilities required for successful execution.

• Must-have: Strong knowledge of semiconductor assembly processes such as Pre-Assembly, Die Attach, Clip Attach, Wire Bond, Molding, Trim and Form, and Singulation; knowledge of final test is an advantage.
• Must-have: Good understanding of packaging materials and manufacturing technologies.
• Must-have: Hands-on experience with engineering and quality methods (SPC, DOE, MSA/GRR, 8D, Root Cause Analysis, DFMEA/PFMEA, Control Plans).
• Must-have: Experience with statistical analysis tools (e.g. JMP, Minitab, Statistica or equivalent).
• Preferred: Experience working with subcontractors in semiconductor manufacturing and supplier technical assessments.
• Strong analytical and problem-solving skills with a continuous-improvement mindset.
• Proven ability to lead cross-functional, global projects and present technical findings to diverse stakeholders.
• Strong interpersonal, leadership and teamwork skills; adaptable to changing project priorities.
• Customer-focused approach to resolving internal and external technical issues.

Education Requirements

Bachelor's degree in engineering is required, preferably in Electronics, Mechanical, Materials, Manufacturing or a closely related discipline.

About the Company

Company: Nexperia

Headquarters: Cabuyao, Philippines

Nexperia is a global leader in semiconductor development with a focus on in-house production. The company boasts a strong international network and is dedicated to innovation and excellence in the semiconductor industry, providing a dynamic environment for its employees.