Senior or Principal Packaging Engineer

Job Title

Senior or Principal Packaging Engineer

Role Summary

Microsoft Quantum seeks a hands-on Packaging Engineer to develop and scale assembly processes and materials for quantum devices. The role works within a multidisciplinary hardware team to adapt industry-standard packaging to the requirements of quantum hardware and to establish robust, repeatable processes across a global organization.

The position reports as an individual contributor and requires collaboration with engineers, scientists, and external suppliers to qualify materials, develop test methods, and support advanced packaging technologies.

Experience Level

Senior / Principal level. Candidates typically meet the listed degree-plus-experience combinations (see Education Requirements) or equivalent experience.

Responsibilities

Primary responsibilities include establishing and scaling packaging processes, qualifying suppliers, and implementing evaluation methods.

• Develop, document, and maintain robust assembly and implementation processes for quantum devices.
• Adapt industry packaging processes and materials to meet quantum-specific requirements.
• Drive and manage external packaging material vendors and evaluate suppliers as scaling partners.
• Design, develop, and implement test equipment and processes to evaluate packaging solutions.
• Perform or direct analysis and simulation of packaging solutions.
• Support development and integration of advanced packaging technologies.
• Work independently or as part of cross-functional teams across distributed locations.
• Comply with required security and export-control screening and documentation processes.

Requirements

Must-have technical capabilities and other role requirements.

• Must have: Hands-on experience in process and materials development for packaging; experience developing and documenting manufacturing or assembly processes.
• Must have: Experience evaluating and qualifying external suppliers and working with vendors to deliver packaging solutions.
• Must have: Ability to develop test methods and equipment for evaluating packaging performance; skill in analysis and simulation of packaging solutions.
• Must have: Ability to meet Microsoft and government security/export-control screening requirements (e.g., background check, citizenship/immigration verification, ITAR/EAR considerations).
• Must have: Ability to use AI tools to support engineering tasks (modeling, analysis, research automation) while following responsible AI safeguards.
• Nice to have: Experience managing outside vendors; experience with industry-standard chip packaging materials and processes.
• Nice to have: Experience with cryogenic materials and microwave device packaging.

Education Requirements

Required: Master's degree in Electrical Engineering, Computer Engineering, Mechanical Engineering, or a related field plus 5+ years technical engineering experience; OR Bachelor's degree in those fields plus 8+ years technical engineering experience; OR equivalent practical experience.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.