Senior Optical Packaging Engineer

Job Title

Senior Optical Packaging Engineer

Role Summary

Individual contributor in Microsoft Research working on packaging architectures for co-packaged optics and advanced optical/electronic integration. The team translates research prototypes into manufacturable solutions for AI infrastructure, collaborating with internal product teams and Tier‑1 partners.

Experience Level

Senior-level individual contributor.

Responsibilities

Design, prototype, and transfer scalable optical packaging solutions that integrate photonic devices with electronic ICs and system-level constraints.

• Define packaging architectures for co‑packaged optics, including photonic devices, ASICs, and interposers.
• Develop and prototype solutions using advanced packaging approaches (2.5D/3D integration, interposers, FOWL/CoWoS/EMIB, etc.), fiber attach, and optical coupling.
• Specify optical assembly and alignment strategies (passive/active alignment, tolerances, manufacturability trade-offs).
• Co‑design with photonics, electronics, and system teams to optimize signal integrity, power delivery, thermal and mechanical performance.
• Engage with Tier‑1 suppliers and manufacturing partners to drive technology transfer and production readiness.
• Build and evaluate prototypes, analyze failure modes, and iterate designs based on measurements and system constraints.

Requirements

Key technical and professional requirements. Degree requirements are listed separately below.

• Must-have: Proven industry experience in wafer/panel level and advanced packaging with a focus on optical packaging or co‑packaged optics.
• Must-have: Hands‑on experience with optical module or CPO packaging design.
• Must-have: Practical skills in fiber attach and optical coupling techniques.
• Must-have: Knowledge of high‑speed interconnect packaging and signal integrity considerations.
• Must-have: Strong understanding of system‑level trade‑offs (electrical, optical, thermal, mechanical) and ability to work in multidisciplinary teams.
• Must-have: Excellent written and spoken English communication skills for technical audiences.
• Nice-to-have: Experience with advanced semiconductor packaging (FCBGA, 2.5D/3D integration).
• Nice-to-have: Familiarity with hyperscale datacenter interconnect requirements.
• Nice-to-have: Experience working with external manufacturing partners and Tier‑1 suppliers; track record delivering packaging solutions from concept to prototype or production.

Education Requirements

Master's or PhD in Electrical Engineering, Photonics, Materials Science, or a related technical field is required.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.