Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)

Job Title

Senior Manager, Package PE, Product and System Engineering (High Bandwidth Memory)

Role Summary

Lead package product and system engineering activities for High Bandwidth Memory (HBM) at Micron's Fab 10A, Singapore. Manage a technical team, drive cross-functional projects, and deliver yield, quality, and test coverage improvements for HBM assembly and packaging.

Experience Level

Senior-level. The role expects extensive industry experience managing technical teams and programs.

Responsibilities

Accountable for technical leadership, project delivery, and cross-functional collaboration to improve HBM product quality and manufacturability.

• Lead and grow a team of product and packaging engineers; coach and mentor future technical leaders.
• Define and drive complex, multi-disciplinary projects from problem definition through resolution.
• Set technical direction and make decisions on risk analysis, project prioritization, and mitigation strategies.
• Improve test coverage and assembly-related processes to reduce Time-0 and package failure DPM and inline fallout.
• Lead electrical failure analysis (EFA) and physical failure analysis (PFA) to identify root causes and corrective actions.
• Collaborate with Technology Development, Packaging, Design, System Development, Fab, and Quality/Reliability teams to implement solutions.
• Serve as subject-matter expert and organization spokesperson on packaging and test issues.

Requirements

Key skills and attributes required for successful performance in this role.

• Proven leadership in technical roles with experience driving cross-functional engineering programs.
• Strong problem-solving skills with in-depth circuit-level analysis and root-cause investigation capability.
• Experience with yield improvement, test optimization, and manufacturing line yield reduction techniques.
• Excellent communication, collaboration, and presentation skills.
• Self-motivated, adaptable, and accountable with a professional work ethic.
• Preferred: product engineering and packaging experience in semiconductor assembly and test.

Education Requirements

Bachelor's or Master’s degree in Electrical, Electronic, or Mechanical Engineering. The role expects more than 12 years of experience in the semiconductor industry (senior-level).

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.