Senior Manager, Package Design Engineering

Job Title

Senior Manager, Package Design Engineering

Role Summary

Lead development and industrialization of semiconductor power-package technologies and associated NPI (new product introduction) activities. Manage technical programs with internal product teams and external OSATs/contract manufacturers to deliver qualified package solutions for AI and data-center power products.

Experience Level

Senior - requires approximately 12 to 15 years of relevant semiconductor package development experience with technical or project leadership responsibilities.

Responsibilities

Accountable for driving package technology from development through production and for coordinating cross-functional and external partners.

• Lead package technology development programs and NPI execution, including schedules, budgets, and resource planning.
• Manage design and development of package and interconnect solutions for power SiP/modules, power modules, and discrete FET packages.
• Plan and execute DOEs, process optimization, and assembly qualification with OSATs and contract manufacturers.
• Evaluate, select, and qualify materials, processes, assembly subcontractors, and contract manufacturers against quality, reliability, cost, and capacity targets.
• Coordinate cross-functional qualification activities with Product, Design, Applications, Quality, Operations, and Reliability teams to meet committed schedules.
• Drive resolution of package/process integration and early-production issues; manage risk assessment, corrective actions, and yield improvement.
• Define and implement production controls and monitoring to prevent quality incidents and improve manufacturing robustness.
• Transfer technology into production and manage ramp-up monitoring, issue escalation, and readiness reviews.
• Contribute to packaging roadmap development and lead execution of assigned technology/product-development programs.
• Establish and maintain package design rules, engineering standards, and customer-facing technical responses.

Requirements

Must-have: substantial hands-on and leadership experience in semiconductor package development, test, and qualification for power products.

• 12–15 years of semiconductor package development experience with technical or project leadership, especially on power SiP/modules, wafer-level and flip-chip packaging.
• Deep knowledge of assembly processes, package and product qualification, reliability methods, SPC, DOE, and statistical analysis tools.
• Proven ability to manage multiple development programs, lead cross-functional technical teams, and influence global manufacturing partners.
• Experience working with OSATs and contract manufacturers to plan qualification, close technical gaps, and optimize processes.
• Strong analytical, problem-solving, project management, written, and verbal communication skills.
• Ability to define production controls, lead corrective actions, and drive yield and reliability improvements.

Nice-to-have: familiarity with SiC/GaN packaging, DBC/AMB substrates, multi-chip modules, wafer-level packaging, flip-chip interconnects, and advanced interconnect technologies.

Education Requirements

Master’s or Bachelor’s degree in Physics, Chemistry, Mechanical Engineering, Electrical Engineering, Materials Engineering, or a related discipline. A doctorate is a plus.

About the Company

Company: Renesas

Headquarters: Hitachinaka, Japan

Renesas is a global leader in embedded semiconductor solutions, providing high-quality products across automotive, industrial, infrastructure, and IoT sectors. With over 22,000 employees in more than 30 countries, the company focuses on scalable solutions that enhance user experience and drive innovation while committed to sustainability and energy efficiency.