Job Title
Senior Manager, High Bandwidth Memory (HBM) — Product Development Team Leader
Role Summary
Lead the introduction, ramp and high-volume production of High Bandwidth Memory (HBM) products. Serve as the technical program owner and provide direction to cross-functional teams including design, test, packaging, manufacturing, supply chain and quality.
Drive vertical integration across global partners to achieve product performance, reliability and schedule targets.
Experience Level
Senior-level. Requires 10+ years of relevant experience in product, design, yield enhancement, or related engineering fields with management or leadership experience.
Responsibilities
Accountable for technical direction, program delivery, and team leadership across the HBM product lifecycle.
- Define program requirements and success criteria; manage Commit Convergence and Engineering Commit Reviews.
- Deliver product milestones, sample commitments and oversee logistics across multifunctional teams.
- Lead critical program reviews and present status and decisions to executives.
- Make technical and program decisions using structured problem framing and analysis of alternatives.
- Identify, prioritize and implement risk mitigation strategies across development stages.
- Coordinate and align global teams for efficient working models and execution.
- Lead change initiatives to improve processes, team dynamics and partnerships.
- Communicate engineering priorities, challenges and status to leadership and stakeholders.
- Mentor and develop team members; conduct performance management and enforce accountability.
Requirements
Key qualifications and capabilities required to perform the role.
- 10+ years of demonstrated technical and program leadership in product development, design, yield enhancement or related engineering domains.
- Proven ability to lead broad, urgent cross-functional technical issues to closure with collaborative solutions.
- Experience managing direct reports and operating in a matrixed, distributed team environment.
- Strong organizational skills and the ability to prioritize for complex technical programs.
- Excellent interpersonal and communication skills for engagement with leadership and cross-functional audiences.
- Ability to delegate, assign priorities and drive accountability within the team.
- Nice-to-have: experience with HBM products, memory for ML/AI workloads, or vertical integration across packaging and manufacturing.
Education Requirements
Bachelor's or Master’s degree in Electrical Engineering or Computer Engineering.
About the Company
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.

Date Posted: 2026-08-19