Senior Manager, HIG HBM Product System Engineering (Media Health Manufacturing)

Job Title

Senior Manager, HIG HBM Product System Engineering (Media Health Manufacturing)

Role Summary

Lead a technical team responsible for Media Health manufacturing and product system engineering for High Bandwidth Memory (HBM) products, including DRAM, interface die, and stacked products. Drive manufacturing test flow development, yield improvement, test-time reduction, DFT strategy, and cross-functional alignment to meet quality, cost, cycle-time, and scale objectives.

This role requires collaborating with Fab, Design, Technology Development, Test Solution Engineering and other teams to validate and qualify next-generation HBM products.

Experience Level

Senior — requires 10+ years of semiconductor industry experience (posting specifies 10+ years).

Responsibilities

Accountable for product and manufacturing test engineering, team leadership, and cross-functional delivery for next-generation HBM products.

• Define and deliver optimized manufacturing test coverage across HBM architectures and process nodes.
• Develop, validate, characterize, and qualify next-generation HBM products (DRAM, interface die, stacked products).
• Support design validation and circuit debug using CAD tools and Verilog simulation where required.
• Drive yield improvement and cost reduction via root-cause analysis, test optimization, and failure resolution (device, qual, RMA).
• Develop and implement DFT strategies and stage new test/DFT ideas to improve cost, quality, and cycle time.
• Reduce test time and optimize manufacturing test flow for high-volume production.
• Lead, mentor, and develop a high-performing team; build project management capability within the team.
• Make technical decisions on risk analysis and project prioritization; act as technical spokesperson and expert for the area.
• Collaborate cross-functionally with Fab, Product Leads, Design, Technology Development, System Development, and Quality/Reliability teams.
• Embed AI/automation into workflows to improve engineering productivity and analysis.

Requirements

Must-have technical and leadership skills to deliver manufacturing-ready HBM products and lead a technical team.

• 10+ years in the semiconductor industry with demonstrated leadership and technical program delivery. (Degree details are in Education Requirements below.)
• Strong problem-solving skills with in-depth circuit analysis and root-cause debugging experience.
• Practical experience in yield improvement, test coverage optimization, and test-time reduction for high-volume manufacturing.
• Experience with DFT strategy, test flow development, and manufacturing test validation.
• Good knowledge of statistics, data analysis tools, and scripting for data-driven decision making.
• Proven cross-functional collaboration and communication skills; strong presentation ability.
• Demonstrated people leadership, mentorship, and project management capability.
• Able to work on-site in Singapore and travel internationally to the US, Taiwan, and Japan as required.
• Micron product engineering experience preferred (nice-to-have).

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering. The posting also specifies 10+ years of semiconductor industry experience; Micron product engineering experience is listed as preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.