Senior Layout Engineer — HIG-HBM

Job Title

Senior Layout Engineer — HIG-HBM

Role Summary

Join the HBM layout team in Hyderabad to develop analog, mixed-signal and custom digital IC layouts for High Bandwidth Memory products. Coordinate with global engineering teams and support full-chip integration and advanced packaging requirements.

Deliver high-quality layouts for critical blocks, participate in tapeouts, and lead layout planning, scheduling, and reviews.

Experience Level

Senior — minimum 6+ years of relevant analog/custom IC layout experience.

Responsibilities

Primary responsibilities include layout development, verification, and project leadership:

• Develop and deliver analog, mixed-signal and custom digital block layouts and support full-chip integration.
• Prepare and tape out PWF reticles; collaborate on advanced packaging requirements.
• Support TSV builds and ensure electrical, thermal, and mechanical performance targets are met.
• Perform layout verification (LVS/DRC/antenna checks), quality control and documentation.
• Estimate area/time, plan schedules, delegate tasks, and ensure on-time delivery across multiple projects.
• Review and mentor junior engineers on sub-block layouts and conduct layout reviews.
• Communicate with global engineering teams to align on build constraints and integration needs.

Requirements

Must-have technical skills and experience:

• 6+ years in analog/custom layout development across advanced CMOS nodes (Planar, FinFET).
• Proficient with Cadence VLE/VXL and Mentor Graphics Calibre DRC/LVS.
• Experience laying out critical analog blocks such as temperature sensors, PLLs, ADCs/DACs, LDOs, bandgaps, reference generators, charge pumps, current mirrors, comparators, and differential amplifiers.
• Strong understanding of analog layout fundamentals: matching, electromigration, latch-up, coupling, crosstalk, IR-drop, and parasitic effects.
• Ability to implement build constraints and work within memory build architectures and hierarchy.
• Skilled in physical verification of custom layouts and managing multiple layout projects with strict quality checks.
• Excellent verbal and written communication skills.

Nice-to-have:

• Experience supporting multiple tape-outs.
• Prior experience with TSVs or advanced packaging integration.

Education Requirements

BE or MTech in Electronics / VLSI Engineering.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.