Senior IC Packaging Engineer

Job Title

Senior IC Packaging Engineer

Role Summary

Join Microsoft Silicon within Cloud Hardware and Infrastructure Engineering to support design, manufacturing, and packaging of custom silicon for cloud infrastructure. The role focuses on package technology selection, supplier qualification, reliability and qualification testing, and manufacturing readiness for high-volume server chips.

This individual contributor role works across silicon, platform, thermal, power and motherboard teams to drive packaging solutions from concept through production.

Experience Level

Senior-level. Typical experience expectation is multi-year technical experience (for reference, equivalent role guidance ranges from ~5+ years depending on degree; see Education Requirements for degree/experience mapping).

Responsibilities

Provide technical leadership for IC packaging across design, qualification and production.

• Define and recommend package technology and assembly approaches, including advanced packaging and chiplet architectures.
• Drive supplier assessments, development, qualification and transition to production (OSATs, foundries, substrate suppliers).
• Develop and execute device/package qualification plans, reliability characterization, and FMEA.
• Design test vehicles and package/assembly drawings to validate silicon, package, and system performance.
• Support substrate design and collaborate with internal teams (silicon architects, motherboard designers, thermal, power/performance).
• Lead cross-functional engineering decisions and translate platform requirements into package/system models.

Requirements

Technical must-haves and relevant competencies.

• Hands-on experience in semiconductor package development, manufacturing, supplier management, or quality/reliability engineering.
• Experience with advanced packaging technologies (examples: BGA, 2.5D, 3D) and substrate design support.
• Experience with OSATs, foundry interactions, and subcontract supplier management.
• Demonstrated ability to perform or interpret physical failure analysis and drive corrective actions.
• Proficiency developing FMEA, qualification plans, and test vehicles for silicon/package validation.
• Strong cross-functional collaboration and clear verbal/written communication skills.
• Ability to meet required security screening and export-control eligibility checks.

Education Requirements

Required: Degree in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry, or related field OR equivalent experience. Microsoft lists degree/experience combinations as: Doctorate + 1+ year technical experience; Master’s + 4+ years; Bachelor’s + 5+ years; or equivalent practical experience. Preferred: higher seniority with Doctorate +3 years, Master’s +6 years, Bachelor’s +8 years, or equivalent; Master’s with ~10 years in semiconductor package product development. Certifications not specified.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.