Senior IC Packaging Engineer

Job Title

Senior IC Packaging Engineer

Role Summary

Join Microsoft’s Silicon, Cloud Hardware, and Infrastructure Engineering (SCHIE) team focused on compute silicon and manufacturing for Azure. This individual contributor role drives advanced IC packaging technology and deliverables across design, qualification, supplier engagement, and production for datacenter hardware.

The role partners with silicon architects, platform and thermal engineers, PCB designers, and suppliers to define and implement 2.5D/3D packaging solutions that meet performance, reliability, manufacturability, and cost targets.

Experience Level

Senior-level. Experience guidance provided in Education Requirements (degree + years or equivalent experience) — typical expectation is experienced IC/package engineers with multiple years in semiconductor package development or supplier/manufacturing roles.

Responsibilities

Accountabilities include technical leadership for package solutions from definition through production and cross-functional execution across product lines.

• Define and drive optimal silicon packaging solutions to meet Azure datacenter product requirements.
• Lead package technology for chiplet architectures and advanced 2.5D/3D packaging (interposer/bridge/substrate).
• Manage package product designs from definition through development and tapeout.
• Define and develop test vehicles to validate silicon, package, and system performance.
• Specify EDA tool requirements and perform package layout and assembly drawing development to support manufacturing.
• Perform supplier assessments; manage suppliers through definition, development, qualification, and production ramp.
• Develop and deliver FMEA and reliability/qualification plans; assess and characterize IC package reliability.
• Drive engineering system design decisions, trade-offs, and cross-team execution involving electrical, mechanical, thermal, and manufacturing constraints.
• Collaborate with silicon, motherboard, thermal, power/performance, and manufacturing teams to ensure platform-level alignment.

Requirements

Key non-education requirements and preferred technical skills. See Education Requirements for degree and experience equivalencies.

• Must-have: Relevant technical engineering experience (see Education Requirements for degree/experience options) and demonstrated experience working with semiconductor packaging, suppliers, or manufacturing processes.
• Must-have: Ability to meet Microsoft Cloud Background Check and provide documentation required for export-control access (proof of citizenship or lawful residency as required).
• Nice-to-have: Hands-on experience in semiconductor package development, manufacturing, supplier management, or quality management.
• Nice-to-have: Experience with advanced packaging technologies (BGA, 2.5D, 3D), OSAT/foundry ecosystems, and physical failure analysis.
• Nice-to-have: Proficiency with IC package or PCB layout CAD tools (for example Cadence Allegro) and 2D/3D simulation tools for package-level extraction and signal/power analysis.
• Nice-to-have: Experience in high-speed signaling layout, electrical/mechanical/thermal co-design, and strong cross-functional communication skills.

Education Requirements

Accepted: Doctorate (PhD), Master’s, or Bachelor’s degrees in Electrical Engineering, Computer Engineering, Computer Science, Physics, Chemistry or related technical fields — OR equivalent practical engineering experience. The posting specifies degree+years options (e.g., PhD+1 year, MS+4 years, BS+5 years) and also notes preferred degree/experience combinations; equivalent experience is explicitly permitted.

About the Company

Company: Microsoft

Headquarters: Redmond, Washington, United States

Microsoft is a global technology company that develops and sells software, services, devices, and solutions. Known for its Windows operating system, Office suite, and Azure cloud platform, Microsoft aims to empower individuals and organizations around the world to achieve more. The company fosters a culture of innovation and inclusion, focusing on delivering trusted experiences to customers and partners globally.