Principal Packaging Engineer

Job Title

Principal Packaging Engineer

Role Summary

Lead design and electrical characterization of advanced high-speed IC packages and Chip-On-Board (COB) solutions for datacenter connectivity products. The role sits within the Packaging Technology team in the Signal Integrity Products business unit and coordinates across design, manufacturing, quality, and reliability functions.

Primary focus areas include 3D signal integrity modeling, IC package layout, experimental RF/SI validation, NPI alignment with suppliers, and mentorship of junior engineers.

Experience Level

Senior level — posting specifies 8+ years of relevant experience in IC package design or signal integrity engineering.

Responsibilities

Deliver package designs and verification for high-speed datacenter products and drive technical alignment through product development and qualification.

• Design high-speed IC packages and COB solutions to meet technical, reliability, and cost targets.
• Perform 3D signal integrity modeling at silicon, package, and system levels.
• Validate models with S-parameter and TDR measurements and other RF/SI test methods.
• Prepare technical reports, application notes, PCB layout guidance, and assembly/process instructions.
• Design and produce PCB and high-density substrate layouts for qualification and evaluation.
• Serve as technical interface with manufacturing suppliers during NPI, package definition, and qualification.
• Evaluate and launch projects with new suppliers and emerging package technologies.
• Mentor junior packaging engineers and improve design methodologies, tools, and workflows.

Requirements

Must-have technical skills and experience for immediate effectiveness in the role.

• Deep expertise in high-speed transmission line theory, crosstalk, impedance control, and return-loss optimization.
• Experience in multi-domain power delivery network (PDN) design and package-level signal/power integrity (SI/PI).
• Hands-on proficiency with EDA tools such as Keysight ADS, Cadence APD/SiP, and Ansys HFSS.
• Practical experience with RF/SI measurement equipment including Vector Network Analyzers (VNA) and Time-Domain Reflectometers (TDR).
• Familiarity with advanced packaging technologies: 2D, 2.5D, 3D, Fan-In/Fan-Out, high-density substrates, silicon bridge interconnects, and Chip-On-Board.
• Working knowledge of JEDEC JESD47H and its implications for design and qualification.
• Proven ability to manage supplier relationships and drive technical alignment through NPI and qualification.
• Strong written and verbal communication skills and ability to produce customer-facing technical documentation.

Nice-to-have:

• Experience in optoelectronics package design or opto-electronic assembly.
• Thermo-mechanical simulation and reliability engineering experience (e.g., FEA for package stress).
• Experience in datacenter/high-speed communications product development (400G+).
• Experience working in a fabless semiconductor environment with global contract manufacturers.

Education Requirements

Minimum: Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field (posting specifies this plus 8+ years of experience). Preferred: Master's degree or Ph.D. in Electrical Engineering, Physics, or a related discipline.

About the Company

Company: Semtech

Headquarters: Camarillo, California, USA

Semtech Corporation is a high-performance semiconductor company providing IoT systems and Cloud connectivity solutions. The company focuses on delivering innovative technology solutions that support a smarter, more connected, and sustainable planet, with a dedication to quality across infrastructure, industrial, and consumer markets.