Senior IC Packaging Development Engineer
NVIDIAJob Title
Senior IC Packaging Development Engineer
Role Summary
Lead development of rapid IC packaging for individual die to support Failure Analysis (FA) and New Product Introduction (NPI) ahead of high-volume manufacturing. Drive R&D with internal teams and external foundry/OSAT partners to establish packaging processes that meet turn-around-time, reliability, and chip-package interaction goals.
Embedded in the IC Failure Analysis team and collaborating closely with IC & package design, process and product engineering.
Experience Level
Senior — 12+ years of hands-on experience in IC packaging development, package design, or NPI.
Responsibilities
Deliver rapid package prototypes and define processes, tooling, and evaluation methods to support FA and NPI.
- Drive package development and rapid prototyping: manage stack-ups, assembly processes, and small-volume builds for FA/NPI.
- Evaluate mechanical, thermal, and material behavior of advanced package architectures.
- Develop and qualify new die-level processing methodologies and packaging materials.
- Coordinate physical and electrical failure analysis to identify root causes of prototype failures.
- Collaborate with IC & package design teams, process/product engineering, foundries, and OSAT partners to implement processes and tooling.
Requirements
Concrete technical skills and hands-on experience required to lead packaging development and FA support.
- Deep expertise in flip-chip, 2.5D/3D packaging, wire bonding, and advanced substrate architectures.
- Proven track record in IC packaging development, NPI, and small-volume prototyping.
- Familiarity with failure analysis techniques and equipment such as SEM, EDX, CSAM, X‑Ray, and LIT.
- Experience coordinating with foundries and OSAT partners and managing cross-functional engineering projects.
- Strong problem-solving skills and experience driving processes to meet reliability and turn-around-time targets.
- Nice-to-have: experience with IC package EDA tools (e.g., Cadence Allegro Package Designer) and FEM tools such as ANSYS or ABAQUS.
Education Requirements
B.S., M.S., or Ph.D., or equivalent experience in Materials Science, Mechanical Engineering, Electrical Engineering, Physics, or a related semiconductor field.
About the Company
Company: NVIDIA
Headquarters: Santa Clara, California, USA
NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.
