Senior HBM Design Architect (PhD NCG)
The Senior HBM Design Architect will design and analyze digital and analog circuits for high-bandwidth memory (HBM) products, including DRAM circuit simulation, optimization, and floorplanning. The role evaluates full-chip and block-level functionality, drives architecture pathfinding, and contributes to memory, logic, and analog circuit design and optimization.
Work with a multi-disciplinary design team to deliver functionally correct, high-performance HBM products using advanced memory technologies.
Senior-level. Specific years of experience not listed; role scales based on experience and qualifications.
Primary responsibilities include technical design, analysis, and architecture exploration for HBM memory products.
Must-have technical skills and professional attributes. Preferred items noted.
NCG Ph.D. or NCG Master with relevant prior experience required.
Company: Micron Technology
Headquarters: Boise, Idaho, USA
Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.
