Senior Failure Analysis Engineer

Job Title

Senior Failure Analysis Engineer

Role Summary

Join the Physical Failure Analysis team to perform physical failure analysis (PFA) on advanced integrated circuits, deep learning processors, and heterogeneous packaging. The role combines physics, process technology, and circuit-level understanding to identify root causes and deliver actionable engineering solutions.

Experience Level

Senior — typically requires 8+ years of relevant, hands-on industry experience.

Responsibilities

Lead and execute complex failure analysis investigations and develop new FA techniques to support product yield, reliability, and design/process optimization.

• Design and implement advanced FA methodologies for leading-edge silicon and heterogeneous packaging.
• Perform precision mechanical cross-sectioning, parallel de-layering, and chemical/plasma de-processing at die, package, component, and board levels.
• Prepare and analyze samples using Focused Ion Beam (FIB) for nanoscale electrical and physical diagnostics.
• Apply optical and electron microscopy (SEM/TEM) and related inspection and analytical techniques to localize and characterize defects.
• Lead root-cause investigations, isolating failures that affect yield, performance, and long-term reliability.
• Provide physical characterization data to support DOE, design optimization, process node improvements, and customer failure analysis requests.
• Develop and optimize FA workflows and specialized characterization platforms to improve lab efficiency and reproducibility.

Requirements

Must-have technical skills and experience; listed as essential vs. desirable.

• Must-have: Demonstrated domain expertise in semiconductor IC fabrication, advanced packaging/assembly, and failure analysis methodologies.
• Must-have: Proven proficiency in precision IC sample preparation for targeted defect localization and physical root-cause analysis.
• Must-have: Hands-on experience with optical and electron microscopy (SEM/TEM) and analytical inspection techniques.
• Must-have: Strong working knowledge of physical and electrical failure analysis across die, package, component, and board levels.
• Must-have: 8+ years of relevant, hands-on industry experience in failure analysis or related roles.
• Nice-to-have: Experience with advanced heterogeneous packaging technologies, deep learning processors, or complex system-level ICs.
• Nice-to-have: Experience developing novel characterization platforms, automation of FA workflows, or leading cross-functional engineering investigations.

Education Requirements

B.S., M.S., or Ph.D. in Electrical Engineering, Materials Science, Physics, or a closely related technical field — or equivalent practical experience.

About the Company

Company: NVIDIA

Headquarters: Santa Clara, California, USA

NVIDIA is a global leader in accelerated computing, renowned for its innovative solutions in AI and digital twins that transform diverse industries. The company specializes in networking technologies, providing end-to-end InfiniBand and Ethernet solutions for servers and storage that optimize performance and scalability. NVIDIA serves sectors such as high-performance computing, enterprise data centers, and cloud computing, constantly reinventing its products and services to stay ahead in the market.