Senior Engineer, Semiconductor Packaging

Job Title

Senior Engineer, Semiconductor Packaging

Role Summary

Develop advanced semiconductor packaging solutions that meet performance, reliability, manufacturability, and cost targets across multiple market segments. Lead package design, electrical simulation, qualification, and transfer to manufacturing.

Collaborate with cross-functional internal teams and external OSAT and substrate partners to optimize processes, resolve technical issues, and document package design guidelines and specifications.

Experience Level

Senior — the posting specifies 2+ years of hands-on semiconductor packaging development or manufacturing experience.

Responsibilities

The role's primary responsibilities include:

• Design, develop, and qualify semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, and module-based products).
• Perform electrical simulations of IC packages, modules, or systems using commercial simulation tools.
• Collaborate with cross-functional teams to define product and packaging requirements and resolve complex technical issues.
• Work with OSAT partners and substrate suppliers to drive process development, optimize manufacturing, and improve yield.
• Establish reliability criteria and coordinate with quality and reliability teams for product qualification.
• Develop and maintain package design guidelines, process specifications, and technical documentation.

Requirements

Must-have technical skills and experience:

• At least 2 years of hands-on experience in semiconductor packaging development or manufacturing.
• Strong understanding of IC packaging materials and their mechanical, thermal, and electrical behaviors.
• Deep knowledge of IC package structures, substrate technologies, and semiconductor assembly processes.
• Hands-on experience with electrical simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar.
• Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
• Strong communication skills and ability to work effectively in cross-functional and global teams.
• Required travel: up to 10%.
• Nice-to-have: experience with Cadence Allegro.

Education Requirements

PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science (as stated in the posting).

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.