Senior Engineer, Semi Packaging Engineering

Job Title

Senior Engineer, Semi Packaging Engineering

Role Summary

Design and qualify advanced integrated circuit (IC) packaging solutions from concept through release-to-manufacturing. Collaborate with cross-functional teams including design, quality, reliability and external suppliers to deliver robust packaging for semiconductor products.

Experience Level

Senior-level role. Requires at least 2 years of relevant packaging engineering experience and demonstrated technical leadership in IC packaging design and qualification.

Responsibilities

The role focuses on package design, simulation, prototyping, and qualification for semiconductor products.

• Develop IC package concepts, select materials, and iterate designs toward manufacturing readiness.
• Perform mechanical stress and thermal simulations at component and system level.
• Execute substrate layout and substrate simulation tasks.
• Assemble prototypes and manage qualification testing and release-to-manufacturing activities.
• Document manufacturing process flows, control plans, and supplier requirements.
• Work with quality and reliability teams to define reliability criteria and qualification plans.
• Communicate technical results and recommendations clearly to global stakeholders.

Requirements

Must-have technical skills and experience; items listed as "nice-to-have" are optional but desirable.

• Must-have: 2+ years experience as a packaging engineer or equivalent role focused on semiconductor device productization.
• Must-have: Proficiency in 3D CAD (SolidWorks) and FEA tools (ANSYS).
• Must-have: Demonstrated experience in IC package design, optimization, and manufacturing.
• Must-have: Reliability engineering and failure analysis experience for IC packages.
• Must-have: Experience with manufacturing control plans, FMEA, PCN, SPC, and DOE.
• Must-have: Experience with semiconductor/electronics assembly processes.
• Nice-to-have: Experience with CAD tools such as AutoCAD.

Education Requirements

Master's degree required in Mechanical Engineering, Materials Science, Electrical Engineering, Autonomy and Robotics Engineering, or a related field. Foreign-education equivalents are acceptable. The posting also specifies a minimum of two years of relevant packaging engineering experience.

About the Company

Company: Analog Devices

Headquarters: Norwood, Massachusetts, USA

Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.