Senior Engineer, Semi Packaging Engineering
Analog DevicesJob Title
Senior Engineer, Semi Packaging Engineering
Role Summary
The Senior Engineer will develop and qualify advanced semiconductor packaging solutions (wire-bond, flip-chip, system-in-package, module-based products) to meet performance, reliability, manufacturability, and cost targets across multiple market segments.
The role collaborates with cross-functional product, quality, reliability, and manufacturing teams as well as OSAT partners and substrate suppliers to resolve technical issues, optimize processes, and maintain package design guidelines and specifications. Position includes a discretionary performance-based bonus and standard company benefits.
Experience Level
Senior-level. The posting specifies 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
Responsibilities
Key responsibilities include:
- Lead design, development, and qualification of semiconductor packages and modules.
- Perform electrical and electromagnetic simulations of IC packages, modules, or systems using commercial tools.
- Collaborate with cross-functional teams to define packaging requirements and resolve technical issues.
- Work with OSATs and substrate suppliers to drive process development, optimize manufacturing, and improve yield.
- Establish and support reliability criteria and qualification plans with quality and reliability teams.
- Develop and maintain package design guidelines, process specifications, and technical documentation.
- Support manufacturing transfer and continuous improvement efforts; travel up to ~10% as required.
Requirements
Must-have technical skills and experience:
- 2+ years of hands-on experience in semiconductor packaging development or manufacturing.
- Practical knowledge of IC packaging materials and their mechanical, thermal, and electrical behavior.
- Strong understanding of IC package structures, substrate technologies, and assembly processes.
- Hands-on experience with electrical/EM simulation tools such as EMPro, ADS, Sigrity, HFSS, or similar.
- Familiarity with RLC extraction, signal integrity, power integrity, electromagnetic simulation, and circuit simulation.
- Experience collaborating with external manufacturing partners (OSATs) and suppliers.
- Strong communication skills and ability to work effectively in global, cross-functional teams.
- Cadence Allegro experience is a plus.
- Note: Applicants who require access to technical data may need export licensing approval; eligibility restrictions apply.
Education Requirements
PhD or Master’s degree in Electrical Engineering, Mechanical Engineering, or Materials Science.
About the Company
Company: Analog Devices
Headquarters: Norwood, Massachusetts, USA
Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.
