Senior Engineer, Semi Packaging Engineering
Develop and manage wafer-level packaging (WLP) technologies across multiple product platforms. Support Analog Devices business units and customers, coordinate with subcontractors/OSATs in Southeast Asia, and lead package development, qualification, and production transfer.
The role focuses on process development, reliability qualification, manufacturability, and cost-competitive package solutions.
Senior level. No specific years-of-experience requirement stated; requires advanced technical expertise and leadership in packaging development.
Key responsibilities include:
Must-have technical skills and experience:
Ph.D. or Master’s degree in Mechanical, Materials, or Electrical Engineering required.
Company: Analog Devices
Headquarters: Norwood, Massachusetts, USA
Analog Devices is a leading global semiconductor company that bridges the physical and digital worlds, enabling breakthroughs at the Intelligent Edge. With a focus on innovation, ADI develops solutions that drive advancements in digitized factories, mobility, and digital healthcare. The company employs around 24,000 people globally and reported revenues exceeding $9 billion in FY24, creating technologies that transform lives across various sectors.
