Senior Engineer - IC Package Design

Job Title

Senior Engineer - IC Package Design

Role Summary

Responsible for planning, coordinating, and executing IC package design activities across semiconductor product programs. Primary focus is program execution, cross-functional coordination, and delivery predictability from early feasibility through tapeout and manufacturing readiness.

Experience Level

Senior. Degree-based minimum experience specified: Bachelor's +2 years, Master's +1 year, or PhD (no additional years specified).

Responsibilities

Support end-to-end package design program execution, maintain visibility into progress, and coordinate cross-functional stakeholders.

• Drive execution of IC package programs from early design planning through tapeout and post-tapeout support.
• Create and maintain execution plans, schedules, milestone trackers and Gantt views.
• Track risks, issues, dependencies, and action items; drive follow-up, escalation, and closure.
• Prepare and deliver status updates, dashboards, and readiness reports for stakeholders.
• Coordinate inputs for design reviews and execution checkpoints; capture outcomes and follow-ups.
• Interface with manufacturing, NPI, substrate engineering, OSATs and suppliers to resolve blocking issues and align schedules.
• Coordinate with EDA/tooling teams to ensure design flows and tools support program needs.
• Draft and maintain process flows, release handoffs, readiness checks, and acceptance criteria.
• Capture lessons learned and update process documentation to reduce execution risk.

Requirements

Must-have practical skills for program-driven IC package delivery; technical familiarity expected. Degree requirements are listed separately in Education Requirements.

• Proven experience supporting complex, cross-functional engineering programs and managing multiple workstreams.
• Strong organizational skills; ability to create and maintain execution dashboards, milestone/dependency trackers, and action-item/risk logs.
• Comfortable driving execution in matrixed organizations without direct authority.
• Strong written and verbal communication skills; able to translate technical activities into clear process steps and reports.
• Familiarity with IC package development lifecycles, design flows, and manufacturing readiness concepts.
• Working knowledge of IC package design, layout, integration, or manufacturing concepts.
• Experience with project/program management tools (dashboards, Gantt charts, milestone trackers).

Nice-to-have:

• Exposure to EDA/package tools such as Cadence APD/SIP, Innovus, Virtuoso, Mentor Xpedition, Valor, RAVEL.
• Scripting or automation experience (Python, TCL) to support reporting and process enforcement.
• Experience triaging EDA and design-flow issues with tool owners and SMEs.

Education Requirements

Bachelor's degree in Chemical, Electrical, Mechanical Engineering, or related field with 2+ years of system/package design or technology engineering experience; OR Master's degree in those fields with 1+ year of relevant experience; OR PhD in Chemical, Electrical, Mechanical Engineering, or related field. "Related field" allowed where appropriate.

About the Company

Company: Qualcomm

Headquarters: San Diego, California, United States

Qualcomm is a global leader in semiconductor and telecommunications equipment, specializing in mobile technologies and innovations. Known for its Adreno GPUs, the company provides solutions enabling advancements in mobile gaming, AI, VR/AR, and autonomous driving. Qualcomm's cutting-edge technology and commitment to high-performance, power-efficient designs drive the evolution of mobile graphics and connectivity worldwide.