Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Job Title

Senior Engineer, HIG-HBM Product Engineering (Media Health Reliability)

Role Summary

Lead a team in HBM Product Engineering responsible for media health and reliability across DRAM, interface die and stacked HBM products. Drive reliability test development, qualification execution, and reductions in extrinsic and intrinsic DPM via optimized manufacturing test flows.

Collaborate with Fab, Technology Development, Quality, Design and System teams to identify reliability gaps, drive root-cause resolution, and enable process conversions for yield and cost improvement. For application assistance or reasonable accommodations, contact hrsupport_sg@micron.com.

Experience Level

Senior-level. The posting specifies a Bachelor's or Master's degree plus approximately 3 years of semiconductor industry experience; the role requires demonstrated leadership and technical depth.

Responsibilities

Key responsibilities include reliability engineering leadership, qualification, DPM reduction, and cross-functional coordination:

• Define reliability stress tests, test flows, and qualification plans for HBM products.
• Manage qualification execution with Global Quality and resolve gating issues.
• Reduce extrinsic (time‑0 and field) and intrinsic reliability DPM via optimized manufacturing test strategy.
• Lead root-cause analysis of qualification and RMA failures using EFA/PFA and drive corrective actions.
• Recommend and support process conversions and high-volume manufacturing to improve yield, cost, and reliability.
• Assess and manage risk with product managers during conversions and releases.
• Apply AI/ML methods (regression, classification, anomaly detection, clustering) to reliability data; identify and pilot high-leverage AI use cases and embed AI/automation into workflows.
• Provide technical decision-making, project prioritization, and mentor engineers to build team capabilities.
• Collaborate across Fab, Technology Development, Design, System Development and Quality teams; support international travel as needed.

Requirements

Must-have technical and leadership qualifications:

• Proven leadership and team development experience; ability to lead technical programs.
• Strong problem-solving with root-cause analysis and in-depth circuit-level understanding.
• Experience with statistical analysis, data tools and scripting for reliability datasets.
• Product engineering experience preferred; demonstrated cross-functional collaboration on complex engineering problems.
• Excellent communication and presentation skills; high accountability and professional work ethic.
• Flexible and motivated; able to adapt between technical and leadership roles in a dynamic environment.
• Onsite work in Singapore with international travel to the US, Taiwan and Japan.

Education Requirements

Bachelor's or Master's degree in Electrical and Electronics Engineering (or related technical field). The posting specifies degree plus approximately 3 years of semiconductor industry experience; product engineering experience is preferred.

About the Company

Company: Micron Technology

Headquarters: Boise, Idaho, USA

Micron Technology is a global leader in memory and storage solutions, dedicated to transforming how the world uses information. The company offers a diverse portfolio of high-performance DRAM, NAND, and NOR memory products under the Micron and Crucial brands. With a commitment to customer focus and technological innovation, Micron drives advancements in artificial intelligence, 5G, and other data-centric applications, empowering users to learn, communicate, and progress.